Inventor
COOMER BOYD L
US6 patents
Patents
6 patentsUS6974775B2Dec 13, 2005
Method and apparatus for making an imprinted conductive circuit using semi-additive plating
INTEL CORP14 citations80
US6899815B2May 31, 2005
Multi-layer integrated circuit package
INTEL CORP7 citations71
US7637008B2Dec 29, 2009
Methods for manufacturing imprinted substrates
INTEL CORP4 citations61
US7245001B2Jul 17, 2007
Multi-layer integrated circuit package
INTEL CORP0 citations50
US7358116B2Apr 15, 2008
Substrate conductive post formation
INTEL CORP1 citations48
US6777648B2Aug 17, 2004
Method and system to manufacture stacked chip devices
INTEL CORP1 citations48