Inventor
HUANG PO-CHENG
TW41 patents
⚠️ This page may combine multiple inventors who share the name “HUANG PO-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
20 patentsUS9147612B2Sep 29, 2015
Method for forming a semiconductor structure
UNITED MICROELECTRONICS CORP7 citations83
US9905430B1Feb 27, 2018
Method for forming semiconductor structure
UNITED MICROELECTRONICS CORP4 citations72
US9875909B1Jan 23, 2018
Method for planarizing material layer
UNITED MICROELECTRONICS CORP3 citations72
US9779989B1Oct 3, 2017
Method for manufacturing metal interconnects
UNITED MICROELECTRONICS CORP3 citations72
US9384996B2Jul 5, 2016
Method for manufacturing semiconductor device and device manufactured by the same
UNITED MICROELECTRONICS CORP4 citations71
US10943910B2Mar 9, 2021
Method for forming semiconductor integrated circuit structure
UNITED MICROELECTRONICS CORP0 citations62
US10923481B2Feb 16, 2021
Semiconductor integrated circuit structure
UNITED MICROELECTRONICS CORP0 citations62
US10722998B2Jul 28, 2020
Wafer polishing pad and using method thereof
UNITED MICROELECTRONICS CORP1 citations62
US9502303B2Nov 22, 2016
Method for manufacturing semiconductor device with a barrier layer having overhung portions
UNITED MICROELECTRONICS CORP2 citations62
US10128251B2Nov 13, 2018
Semiconductor integrated circuit structure and method for forming the same
UNITED MICROELECTRONICS CORP0 citations52
US9466535B2Oct 11, 2016
Method of forming target patterns
UNITED MICROELECTRONICS CORP0 citations52
US9673053B2Jun 6, 2017
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP1 citations51
US9299600B2Mar 29, 2016
Method for repairing an oxide layer and method for manufacturing a semiconductor structure applying the same
UNITED MICROELECTRONICS CORP0 citations51
US9093465B2Jul 28, 2015
Method of fabricating semiconductor device
UNITED MICROELECTRONICS CORP1 citations51
US8940600B2Jan 27, 2015
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US9443726B1Sep 13, 2016
Semiconductor process
UNITED MICROELECTRONICS CORP1 citations50
US9466484B1Oct 11, 2016
Manufacturing method of semiconductor device
UNITED MICROELECTRONICS CORP1 citations48
US10734276B2Aug 4, 2020
Planarization method
UNITED MICROELECTRONICS CORP0 citations41
US9972498B2May 15, 2018
Method of fabricating a gate cap layer
UNITED MICROELECTRONICS CORP0 citations41
US9443952B2Sep 13, 2016
Method of forming semiconductor device
UNITED MICROELECTRONICS CORP0 citations39
IONETWORKS INC
4 patentsUS11328535B1May 10, 2022
Motion identification method and system
IONETWORKS INC17 citations82
US11328160B2May 10, 2022
Video condensation and recognition method and system thereof
IONETWORKS INC2 citations63
US11992322B2May 28, 2024
Heart rhythm detection method and system using radar sensor
IONETWORKS INC0 citations45
US11796668B2Oct 24, 2023
Radar detection and identification device
IONETWORKS INC0 citations45
TAIWAN GREEN POINT ENTPR CO
4 patentsUS11349224B2May 31, 2022
Conformal array antenna
TAIWAN GREEN POINT ENTPR CO0 citations61
US10573975B2Feb 25, 2020
Method of making a conformal array antenna
TAIWAN GREEN POINT ENTPR CO0 citations51
US10781982B2Sep 22, 2020
Method for making an LED lighting fixture
TAIWAN GREEN POINT ENTPR CO0 citations47
US9976709B2May 22, 2018
Method for making an LED lighting fixture
TAIWAN GREEN POINT ENTPR CO0 citations47