Inventor

FURMAN BRUCE K

US43 patents

⚠️ This page may combine multiple inventors who share the name “FURMAN BRUCE K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FURMAN BRUCE K

IBM

Cooling apparatus with cold plate formed in situ on a surface to be cooled

Layer transfer process and functionally enhanced integrated circuits produced thereby

Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale

Thin-film field-effect transistor with organic semiconductor requiring low operating voltages

Thin-film field-effect transistor with organic semiconductor requiring low operating voltages

Deaggregated electrically conductive polymers and precursors thereof

Method for fabricating multi-layer thin film structure having a separation layer

Multi-layer thin film structure and parallel processing method for fabricating same

Thermo-compression bonded electrical interconnect structure and method

Electrical interconnect structure and method

Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled

Patterned metal thermal interface

Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof

Electronic package method and structure with cure-melt hierarchy

Fluidic cooling systems and methods for electronic components

Method and apparatus for providing parallel optoelectronic communication with an electronic device

Thermo-compression bonded electrical interconnect structure and method

Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale

Hermetic seal and reliable bonding structures for 3D applications

Method and apparatus for deploying a liquid metal thermal interface for chip cooling

Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof

Deaggregated electrically conductive polymers and precursors thereof

Deaggregated electrically conductive polymers and precursors thereof

Methods of fabrication of deaggregated electrically conductive polymers and precursors therefor

Deaggregated electrically conductive polymers and precursors thereof

Method and apparatus for deploying a liquid metal thermal interface for chip cooling

Structure for cooling a surface

Hermetic seal and reliable bonding structures for 3D applications

Structure for cooling a surface

Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof

Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof

Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed

Deaggregated electrically conductive polymers and precursors thereof

FURMAN BRUCE K

Thermo-compression bonded electrical interconnect structure and method

Patterned metal thermal interface

Thermo-compression bonded electrical interconnect structure

BUCHWALTER STEPHEN LESLIE

Electrical interconnect forming method

Electrical interconnect structure

Electrical interconnect forming method

CHEN KUAN-NENG

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric

(unassigned)

Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric