P

Inventor

LI YU-TING

TW28 patents
⚠️ This page may combine multiple inventors who share the name “LI YU-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

22 patents
US9773682B1Sep 26, 2017

Method of planarizing substrate surface

UNITED MICROELECTRONICS CORP5 citations83
US9147612B2Sep 29, 2015

Method for forming a semiconductor structure

UNITED MICROELECTRONICS CORP7 citations83
US9905430B1Feb 27, 2018

Method for forming semiconductor structure

UNITED MICROELECTRONICS CORP4 citations72
US9875909B1Jan 23, 2018

Method for planarizing material layer

UNITED MICROELECTRONICS CORP3 citations72
US9384996B2Jul 5, 2016

Method for manufacturing semiconductor device and device manufactured by the same

UNITED MICROELECTRONICS CORP4 citations71
US10943910B2Mar 9, 2021

Method for forming semiconductor integrated circuit structure

UNITED MICROELECTRONICS CORP0 citations62
US10923481B2Feb 16, 2021

Semiconductor integrated circuit structure

UNITED MICROELECTRONICS CORP0 citations62
US9502303B2Nov 22, 2016

Method for manufacturing semiconductor device with a barrier layer having overhung portions

UNITED MICROELECTRONICS CORP2 citations62
US9012300B2Apr 21, 2015

Manufacturing method for a shallow trench isolation

UNITED MICROELECTRONICS CORP2 citations61
US10276367B1Apr 30, 2019

Method for improving wafer surface uniformity

UNITED MICROELECTRONICS CORP0 citations52
US10128251B2Nov 13, 2018

Semiconductor integrated circuit structure and method for forming the same

UNITED MICROELECTRONICS CORP0 citations52
US9466535B2Oct 11, 2016

Method of forming target patterns

UNITED MICROELECTRONICS CORP0 citations52
US10103034B2Oct 16, 2018

Method of planarizing substrate surface

UNITED MICROELECTRONICS CORP0 citations51
US10049887B2Aug 14, 2018

Method of planarizing substrate surface

UNITED MICROELECTRONICS CORP0 citations51
US9673053B2Jun 6, 2017

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP1 citations51
US9299600B2Mar 29, 2016

Method for repairing an oxide layer and method for manufacturing a semiconductor structure applying the same

UNITED MICROELECTRONICS CORP0 citations51
US9093465B2Jul 28, 2015

Method of fabricating semiconductor device

UNITED MICROELECTRONICS CORP1 citations51
US8940600B2Jan 27, 2015

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US9443726B1Sep 13, 2016

Semiconductor process

UNITED MICROELECTRONICS CORP1 citations50
US9466484B1Oct 11, 2016

Manufacturing method of semiconductor device

UNITED MICROELECTRONICS CORP1 citations48
US10734276B2Aug 4, 2020

Planarization method

UNITED MICROELECTRONICS CORP0 citations41
US9972498B2May 15, 2018

Method of fabricating a gate cap layer

UNITED MICROELECTRONICS CORP0 citations41

INTEL CORP

2 patents

HSU CHUN-WEI

1 patent

UNIV TAIPEI MEDICAL

1 patent

REALTEK SEMICONDUCTOR CORP

1 patent

WISTRON CORP

1 patent