Inventor
NOWAK MATTHEW MICHAEL
US43 patents
⚠️ This page may combine multiple inventors who share the name “NOWAK MATTHEW MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
35 patentsUS9793164B2Oct 17, 2017
Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices
QUALCOMM INC23 citations94
US9373782B2Jun 21, 2016
MTJ structure and integration scheme
QUALCOMM INC21 citations93
US10271745B2Apr 30, 2019
Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing
QUALCOMM INC8 citations84
US10242957B2Mar 26, 2019
Compartment shielding in flip-chip (FC) module
QUALCOMM INC13 citations84
US9620463B2Apr 11, 2017
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)
QUALCOMM INC10 citations84
US9425761B2Aug 23, 2016
High pass filters and low pass filters using through glass via technology
QUALCOMM INC9 citations84
US9343135B2May 17, 2016
Physically unclonable function based on programming voltage of magnetoresistive random-access memory
QUALCOMM INC17 citations84
US9298946B2Mar 29, 2016
Physically unclonable function based on breakdown voltage of metal-insulator-metal device
QUALCOMM INC17 citations84
US8536678B2Sep 17, 2013
Through substrate via with embedded decoupling capacitor
QUALCOMM INC8 citations84
US8375173B2Feb 12, 2013
Accessing a multi-channel memory system having non-uniform page sizes
QUALCOMM INC10 citations84
US8359421B2Jan 22, 2013
Partitioning a crossbar interconnect in a multi-channel memory system
QUALCOMM INC7 citations84
US9138191B1Sep 22, 2015
Integrated circuit module with lead frame micro-needles
QUALCOMM INC7 citations83
US8797792B2Aug 5, 2014
Non-reversible state at a bitcell having a first magnetic tunnel junction and a second magnetic tunnel junction
QUALCOMM INC6 citations83
US10546852B2Jan 28, 2020
Integrated semiconductor devices and method of fabricating the same
QUALCOMM INC3 citations73
US10157992B2Dec 18, 2018
Nanowire device with reduced parasitics
QUALCOMM INC3 citations73
US10043796B2Aug 7, 2018
Vertically stacked nanowire field effect transistors
QUALCOMM INC4 citations73
US9768109B2Sep 19, 2017
Integrated circuits (ICS) on a glass substrate
QUALCOMM INC3 citations73
US9673275B2Jun 6, 2017
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits
QUALCOMM INC6 citations73
US9660110B2May 23, 2017
Varactor device with backside contact
QUALCOMM INC3 citations73
US9508439B2Nov 29, 2016
Non-volatile multiple time programmable memory device
QUALCOMM INC4 citations73
US9230630B2Jan 5, 2016
Physically unclonable function based on the initial logical state of magnetoresistive random-access memory
QUALCOMM INC3 citations73
US9214214B2Dec 15, 2015
Physically unclonable function based on the random logical state of magnetoresistive random-access memory
QUALCOMM INC4 citations73
US9906318B2Feb 27, 2018
Frequency multiplexer
QUALCOMM INC3 citations71
US10582609B2Mar 3, 2020
Integration of through glass via (TGV) filter and acoustic filter
QUALCOMM INC4 citations70
US8380940B2Feb 19, 2013
Multi-channel multi-port memory
QUALCOMM INC4 citations63
US10903240B2Jan 26, 2021
Integrated circuits (ICs) on a glass substrate
QUALCOMM INC0 citations62
US9135976B2Sep 15, 2015
Method and apparatus of probabilistic programming multi-level memory in cluster states of bi-stable elements
QUALCOMM INC2 citations61
US8987062B2Mar 24, 2015
Active thermal control for stacked IC devices
QUALCOMM INC2 citations60
US10332911B2Jun 25, 2019
Integrated circuits (ICs) on a glass substrate
QUALCOMM INC0 citations52
US10158030B2Dec 18, 2018
CMOS and bipolar device integration including a tunable capacitor
QUALCOMM INC1 citations52
US9478541B2Oct 25, 2016
Half node scaling for vertical structures
QUALCOMM INC0 citations52
US9425096B2Aug 23, 2016
Air gap between tungsten metal lines for interconnects with reduced RC delay
QUALCOMM INC0 citations52
US9264013B2Feb 16, 2016
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
QUALCOMM INC1 citations52
US9202789B2Dec 1, 2015
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
QUALCOMM INC1 citations52
US9202705B1Dec 1, 2015
Integrated circuit module with lead frame micro-needles
QUALCOMM INC0 citations51