P

Inventor

NOWAK MATTHEW MICHAEL

US43 patents
⚠️ This page may combine multiple inventors who share the name “NOWAK MATTHEW MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

35 patents
US9793164B2Oct 17, 2017

Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices

QUALCOMM INC23 citations94
US9373782B2Jun 21, 2016

MTJ structure and integration scheme

QUALCOMM INC21 citations93
US10271745B2Apr 30, 2019

Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing

QUALCOMM INC8 citations84
US10242957B2Mar 26, 2019

Compartment shielding in flip-chip (FC) module

QUALCOMM INC13 citations84
US9620463B2Apr 11, 2017

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

QUALCOMM INC10 citations84
US9425761B2Aug 23, 2016

High pass filters and low pass filters using through glass via technology

QUALCOMM INC9 citations84
US9343135B2May 17, 2016

Physically unclonable function based on programming voltage of magnetoresistive random-access memory

QUALCOMM INC17 citations84
US9298946B2Mar 29, 2016

Physically unclonable function based on breakdown voltage of metal-insulator-metal device

QUALCOMM INC17 citations84
US8536678B2Sep 17, 2013

Through substrate via with embedded decoupling capacitor

QUALCOMM INC8 citations84
US8375173B2Feb 12, 2013

Accessing a multi-channel memory system having non-uniform page sizes

QUALCOMM INC10 citations84
US8359421B2Jan 22, 2013

Partitioning a crossbar interconnect in a multi-channel memory system

QUALCOMM INC7 citations84
US9138191B1Sep 22, 2015

Integrated circuit module with lead frame micro-needles

QUALCOMM INC7 citations83
US8797792B2Aug 5, 2014

Non-reversible state at a bitcell having a first magnetic tunnel junction and a second magnetic tunnel junction

QUALCOMM INC6 citations83
US10546852B2Jan 28, 2020

Integrated semiconductor devices and method of fabricating the same

QUALCOMM INC3 citations73
US10157992B2Dec 18, 2018

Nanowire device with reduced parasitics

QUALCOMM INC3 citations73
US10043796B2Aug 7, 2018

Vertically stacked nanowire field effect transistors

QUALCOMM INC4 citations73
US9768109B2Sep 19, 2017

Integrated circuits (ICS) on a glass substrate

QUALCOMM INC3 citations73
US9673275B2Jun 6, 2017

Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits

QUALCOMM INC6 citations73
US9660110B2May 23, 2017

Varactor device with backside contact

QUALCOMM INC3 citations73
US9508439B2Nov 29, 2016

Non-volatile multiple time programmable memory device

QUALCOMM INC4 citations73
US9230630B2Jan 5, 2016

Physically unclonable function based on the initial logical state of magnetoresistive random-access memory

QUALCOMM INC3 citations73
US9214214B2Dec 15, 2015

Physically unclonable function based on the random logical state of magnetoresistive random-access memory

QUALCOMM INC4 citations73
US9906318B2Feb 27, 2018

Frequency multiplexer

QUALCOMM INC3 citations71
US10582609B2Mar 3, 2020

Integration of through glass via (TGV) filter and acoustic filter

QUALCOMM INC4 citations70
US8380940B2Feb 19, 2013

Multi-channel multi-port memory

QUALCOMM INC4 citations63
US10903240B2Jan 26, 2021

Integrated circuits (ICs) on a glass substrate

QUALCOMM INC0 citations62
US9135976B2Sep 15, 2015

Method and apparatus of probabilistic programming multi-level memory in cluster states of bi-stable elements

QUALCOMM INC2 citations61
US8987062B2Mar 24, 2015

Active thermal control for stacked IC devices

QUALCOMM INC2 citations60
US10332911B2Jun 25, 2019

Integrated circuits (ICs) on a glass substrate

QUALCOMM INC0 citations52
US10158030B2Dec 18, 2018

CMOS and bipolar device integration including a tunable capacitor

QUALCOMM INC1 citations52
US9478541B2Oct 25, 2016

Half node scaling for vertical structures

QUALCOMM INC0 citations52
US9425096B2Aug 23, 2016

Air gap between tungsten metal lines for interconnects with reduced RC delay

QUALCOMM INC0 citations52
US9264013B2Feb 16, 2016

Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods

QUALCOMM INC1 citations52
US9202789B2Dec 1, 2015

Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package

QUALCOMM INC1 citations52
US9202705B1Dec 1, 2015

Integrated circuit module with lead frame micro-needles

QUALCOMM INC0 citations51

NOWAK MATTHEW MICHAEL

2 patents

RAO HARI M

1 patent

WU WENQING

1 patent

WANG FENG

1 patent

LAN JE-HSIUNG

1 patent

KIM JONGHAE

1 patent

QUALCOMM MEMS TECHNOLOGIES INC

1 patent