Inventor

TSANG CORNELIA K

US54 patents

⚠️ This page may combine multiple inventors who share the name “TSANG CORNELIA K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSANG CORNELIA K

IBM

Conductive through via process for electronic device carriers

Silicon chip carrier with conductive through-vias and method for fabricating same

Techniques for providing decoupling capacitance

Optimal tungsten through wafer via and process of fabricating same

Low temperature adhesive resins for wafer bonding

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Integrated module for data processing system

Hermetic seal and reliable bonding structures for 3D applications

Silicon-on-insulator structures for through via in silicon carriers

Techniques for providing decoupling capacitance

Chip stack structures that implement two-phase cooling with radial flow

Thin, flexible microsystem with integrated energy source

Chip stack structures that implement two-phase cooling with radial flow

Small area, robust silicon via structure and process

Techniques for providing decoupling capacitance

Techniques for providing decoupling capacitance

Techniques for providing decoupling capacitance

Self-contained heat sink and a method for fabricating same

Direct bond transfer layers for manufacturable sealing of microfluidic chips

Low temperature adhesive resins for wafer bonding

Integrated circuit assembly with cushion polymer layer

Large channel interconnects with through silicon Vias (TSVs) and method for constructing the same

Large channel interconnects with through silicon vias (TSVs) and method for constructing the same

Low temperature adhesive resins for wafer bonding

Small area, robust silicon via structure and process

Hermetic seal and reliable bonding structures for 3D applications

Method for precision assembly of integrated circuit chip packages

Chip stack structures that implement two-phase cooling with radial flow

Direct bond transfer layers for manufacturable sealing of microfluidic chips

Thin 3D die with electromagnetic radiation blocking encapsulation

Thin 3D die with electromagnetic radiation blocking encapsulation

CMOS structure on replacement substrate

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed

Conductive through via structure and process for electronic device carriers

ANDRY PAUL S

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Optimized annular copper TSV

Process for wet singulation using a dicing singulation structure

High-yield method of exposing and contacting through-silicon vias

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

CMOS structure and method of manufacture

Structure and method for creating reliable deep via connections in a silicon carrier

Electrostatic chucking of an insulator handle substrate

Electrostatic chucking of an insulator handle substrate

CHEN KUAN-NENG

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric

DANG BING

Laser ablation of adhesive for integrated circuit fabrication

Laser ablation for integrated circuit fabrication

GLOBALFOUNDRIES INC

Flattened substrate surface for substrate bonding

ANDERSON BRENT A

Silicon-on-insulator structures for through via in silicon carriers

COONEY III EDWARD C

Flattened substrate surface for substrate bonding