Inventor

YOUNG ALBERT M

US45 patents

⚠️ This page may combine multiple inventors who share the name “YOUNG ALBERT M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YOUNG ALBERT M

IBM

Wafer level I/O test, repair and/or customization enabled by I/O layer

Wafer level I/O test and repair enabled by I/O layer

Hermetic seal and reliable bonding structures for 3D applications

Backside power rails and power distribution network for density scaling

Programmable via structure for three dimensional integration technology

Stacked field effect transistor contacts

Stacked field effect transistor

Subtractive source drain contact for stacked devices

Stacked FET with extremely small cell height

Bottom contact with self-aligned spacer for stacked semiconductor devices

Method and structure of forming independent contact for staggered CFET

Local interconnect for cross coupling

Middle of line structure with stacked devices

Vertically-stacked field effect transistor cell

Backside electrical contacts to buried power rails

Backside power rail integration

Hermetic seal and reliable bonding structures for 3D applications

Programmable via structure for three dimensional integration technology

Programmable via structure and method of fabricating same

Low-cost strained SOI substrate for high-performance CMOS technology

Static random access memory using vertical transport field effect transistors

Static random access memory using vertical transport field effect transistors

Method and structure for optimizing yield of 3-D chip manufacture

Method and structure for optimizing yield of 3-D chip manufacture

Efficient voltage conversion

Efficient voltage conversion

Programmable via structure and method of fabricating same

High aspect ratio contact structure with multiple metal stacks

Staggered stacked semiconductor devices

AEROSPACE CORP

Active feedback pulsed measurement method

Feed forward linearized traveling wave tube

Hybrid active combiner and circulator

Multiple signal intermodulation reduction system

Precision frequency change detector

FAROOQ MUKTA G

3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

3D integrated circuit device fabrication using interface wafer as permanent carrier

Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier

Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier

MASSACHUSETTS INST TECHNOLOGY

Optoelectronic detection system

Optoelectronic detection system

CHANG LELAND

Adaptive interconnect structure

Method of forming adaptive interconnect structure having programmable contacts

LIU FEI

Bow-balanced 3D chip stacking

HARPER JAMES DOUGLAS

Optoelectronic detection system