Inventor

ENGLAND LUKE G

BE21 patents

⚠️ This page may combine multiple inventors who share the name “ENGLAND LUKE G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ENGLAND LUKE G

MICRON TECHNOLOGY INC

Semiconductor die assemblies and semiconductor devices including same

Methods of fabricating semiconductor die assemblies

Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

Pillar on pad interconnect structures, semiconductor devices including same and related methods

Methods for forming interconnect assemblies with probed bond pads

Methods for forming interconnect assemblies with probed bond pads

GLOBALFOUNDRIES INC

Vertically stacked wafers and methods of forming same

Integrated circuit package with thermally conductive pillar

Interconnect structure with adhesive dielectric layer and methods of forming same

3D IC package with RDL interposer and related method

Latency compensation network using timing slack sensors

Methods of forming integrated circuit package with thermally conductive pillar

ENGLAND LUKE G

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

FAY OWEN R

Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods

Interconnect assemblies with probed bond pads

GROOTHUIS STEVEN K

Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

GLOBALFOUNDRIES US INC

3D IC package with RDL interposer and related method