Inventor
KOOPMANS MICHEL
US33 patents
⚠️ This page may combine multiple inventors who share the name “KOOPMANS MICHEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
30 patentsUS6847105B2Jan 25, 2005
Bumping technology in stacked die configurations
MICRON TECHNOLOGY INC157 citations99
US6706557B2Mar 16, 2004
Method of fabricating stacked die configurations utilizing redistribution bond pads
MICRON TECHNOLOGY INC168 citations99
US6589809B1Jul 8, 2003
Method for attaching semiconductor components to a substrate using local UV curing of dicing tape
MICRON TECHNOLOGY INC76 citations98
US10461059B2Oct 29, 2019
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
MICRON TECHNOLOGY INC22 citations94
US9379091B2Jun 28, 2016
Semiconductor die assemblies and semiconductor devices including same
MICRON TECHNOLOGY INC15 citations92
US9287240B2Mar 15, 2016
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
MICRON TECHNOLOGY INC21 citations92
US6911624B2Jun 28, 2005
Component installation, removal, and replacement apparatus and method
MICRON TECHNOLOGY INC26 citations92
US6845901B2Jan 25, 2005
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
MICRON TECHNOLOGY INC13 citations92
US9881910B2Jan 30, 2018
Apparatuses and methods for forming die stacks
MICRON TECHNOLOGY INC4 citations84
US9768147B2Sep 19, 2017
Thermal pads between stacked semiconductor dies and associated systems and methods
MICRON TECHNOLOGY INC5 citations84
US9733304B2Aug 15, 2017
Semiconductor device test apparatuses
MICRON TECHNOLOGY INC5 citations84
US9711494B2Jul 18, 2017
Methods of fabricating semiconductor die assemblies
MICRON TECHNOLOGY INC7 citations84
US9659917B1May 23, 2017
Apparatuses and methods for forming die stacks
MICRON TECHNOLOGY INC6 citations84
US9269700B2Feb 23, 2016
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
MICRON TECHNOLOGY INC7 citations84
US6943094B2Sep 13, 2005
Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assembly
MICRON TECHNOLOGY INC12 citations84
US7347348B2Mar 25, 2008
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
MICRON TECHNOLOGY INC5 citations74
US10481200B2Nov 19, 2019
Semiconductor device test apparatuses comprising at least one test site having an array of pockets
MICRON TECHNOLOGY INC1 citations73
US8828798B2Sep 9, 2014
Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
MICRON TECHNOLOGY INC4 citations73
US10242726B1Mar 26, 2019
Memory arrays, and methods of forming memory arrays
MICRON TECHNOLOGY INC1 citations72
US12033980B2Jul 9, 2024
Thermal pads between stacked semiconductor dies and associated systems and methods
MICRON TECHNOLOGY INC0 citations63
US10126357B2Nov 13, 2018
Methods of testing semiconductor devices comprising a die stack having protruding conductive elements
MICRON TECHNOLOGY INC1 citations63
US10062679B2Aug 28, 2018
Apparatuses and methods for forming die stacks
MICRON TECHNOLOGY INC1 citations63
US7637412B2Dec 29, 2009
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
MICRON TECHNOLOGY INC1 citations63
US11004494B2May 11, 2021
Memory arrays, and methods of forming memory arrays
MICRON TECHNOLOGY INC0 citations62
US10153027B1Dec 11, 2018
Memory arrays, and methods of forming memory arrays
MICRON TECHNOLOGY INC1 citations62
US10083734B1Sep 25, 2018
Memory arrays
MICRON TECHNOLOGY INC1 citations62
US10651155B2May 12, 2020
Thermal pads between stacked semiconductor dies and associated systems and methods
MICRON TECHNOLOGY INC0 citations52
US10269782B2Apr 23, 2019
Apparatuses and methods for forming die stacks
MICRON TECHNOLOGY INC0 citations52
US10096579B2Oct 9, 2018
Thermal pads between stacked semiconductor dies and associated systems and methods
MICRON TECHNOLOGY INC0 citations52
US9818625B2Nov 14, 2017
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
MICRON TECHNOLOGY INC1 citations52