Inventor

WALKER GEORGE F

US54 patents

⚠️ This page may combine multiple inventors who share the name “WALKER GEORGE F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WALKER GEORGE F

IBM

Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer

Three dimensional high performance interconnection package

Common ball-limiting metallurgy for I/O sites

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Method of forming a three dimensional high performance interconnection package

Method of fabricating nendritic materials

Connector assembly for chip testing

Semiconductor wafer test and burn-in

Stepped electronic device package

Electrically conductive polymeric

Separable electrical connection technology

Process of making pinless connector

Flex circuit card elastomeric cable connector assembly

Flex circuit card elastomeric cable connector assembly

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Spring array connector

Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates

Empathy injection for question-answering systems

Fuse structure and method to form the same

Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped

Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Process for producing ceramic circuit structures having conductive vias

Electrically conductive polymeric materials and uses thereof

Electrically conductive polymeric materials and uses thereof

Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation

Empathy injection for question-answering systems

Empathy injection for question-answering systems

Forming of high aspect ratio conductive structure using injection molded solder

Method for testing chips on flat solder bumps

Ultrasonic method and actuator for inducing motion of an object

High density space transformer and method of fabricating same

Fuse structure and method to form the same

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Reinforced integrated circuits

Formation of metallic interconnects by grit blasting

Electronic devices having metallurgies containing copper-semiconductor compounds

Flexible assembly of stacked chips

Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped

Process for making a multileveled electronic package

Poly(aryl ether benzimidazoles)

Semiconductor device having metallic interconnects formed by grit blasting

Optical storage device

Method for producing thermally matched probe assembly

Reduction of entropic barrier of polyelectrolyte molecules in a nanopore device with agarose gel

Reduction of entropic barrier of polyelectrolyte molecules in a nanopore device with agarose gel

HOVEL HAROLD J

Super lattice/quantum well nanowires

Super lattice/quantum well nanowires

AFZALI-ARDAKANI ALI

DNA sequencing using multiple metal layer structure with organic coatings forming transient bonding to DNA bases

HARRER STEFAN

Charged entities as locomotive to control motion of polymers through a nanochannel