Inventor
CHAN YA FANG
TW7 patents
Patents
7 patentsUS11037853B1Jun 15, 2021
Semiconductor package structure and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations69
US11056435B2Jul 6, 2021
Semiconductor package with chamfered pads
ADVANCED SEMICONDUCTOR ENG1 citations60
US12272687B2Apr 8, 2025
Semiconductor device package with conductive pillars and reinforcing and encapsulating layers
ADVANCED SEMICONDUCTOR ENG0 citations59
US12107056B2Oct 1, 2024
Semiconductor device package and the method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US11521958B2Dec 6, 2022
Semiconductor device package with conductive pillars and reinforcing and encapsulating layers
ADVANCED SEMICONDUCTOR ENG0 citations59
US11791227B2Oct 17, 2023
Electronic device package
ADVANCED SEMICONDUCTOR ENG0 citations57
US12512337B2Dec 30, 2025
Method for manufacturing semiconductor package and apparatus for flattening workpiece
ADVANCED SEMICONDUCTOR ENG0 citations53