Inventor
SHERAW CHRISTOPHER D
US24 patents
⚠️ This page may combine multiple inventors who share the name “SHERAW CHRISTOPHER D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS7375410B2May 20, 2008
Ultra-thin SOI vertical bipolar transistors with an inversion collector on thin-buried oxide (BOX) for low substrate-bias operation and methods thereof
IBM17 citations92
US7115965B2Oct 3, 2006
Vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness for low-substrate bias operation
IBM16 citations92
US8940595B2Jan 27, 2015
Faceted intrinsic epitaxial buffer layer for reducing short channel effects while maximizing channel stress levels
IBM8 citations84
US7485537B2Feb 3, 2009
Method of fabricating a vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness
IBM12 citations83
US7691716B2Apr 6, 2010
Vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness for low-substrate bias operation
IBM10 citations82
US7911024B2Mar 22, 2011
Ultra-thin SOI vertical bipolar transistors with an inversion collector on thin-buried oxide (BOX) for low substrate-bias operation and methods thereof
IBM6 citations73
US9287399B2Mar 15, 2016
Faceted intrinsic epitaxial buffer layer for reducing short channel effects while maximizing channel stress levels
IBM5 citations72
US7871893B2Jan 18, 2011
Method for non-selective shallow trench isolation reactive ion etch for patterning hybrid-oriented devices compatible with high-performance highly-integrated logic devices
IBM4 citations63
US7956417B2Jun 7, 2011
Method of reducing stacking faults through annealing
IBM3 citations62
US7763518B2Jul 27, 2010
Ultra-thin SOI vertical bipolar transistors with an inversion collector on thin-buried oxide (BOX) for low substrate-bias operation and methods thereof
IBM4 citations62
US7674720B2Mar 9, 2010
Stacking fault reduction in epitaxially grown silicon
IBM2 citations62
US7498256B2Mar 3, 2009
Copper contact via structure using hybrid barrier layer
IBM5 citations62
US7494918B2Feb 24, 2009
Semiconductor structures including multiple crystallographic orientations and methods for fabrication thereof
IBM6 citations62
US7491598B2Feb 17, 2009
CMOS circuits including a passive element having a low end resistance
IBM3 citations60
US7227204B2Jun 5, 2007
Structure for improved diode ideality
IBM6 citations58
US7893493B2Feb 22, 2011
Stacking fault reduction in epitaxially grown silicon
IBM0 citations52
US7820501B2Oct 26, 2010
Decoder for a stationary switch machine
IBM0 citations52
US7361959B2Apr 22, 2008
CMOS circuits including a passive element having a low end resistance
IBM0 citations49
GLOBALFOUNDRIES INC
4 patentsUS10396078B2Aug 27, 2019
Integrated circuit structure including laterally recessed source/drain epitaxial region and method of forming same
GLOBALFOUNDRIES INC9 citations82
US10020307B1Jul 10, 2018
Integrated circuit structure including laterally recessed source/drain epitaxial region and method of forming same
GLOBALFOUNDRIES INC9 citations82
US9634084B1Apr 25, 2017
Conformal buffer layer in source and drain regions of fin-type transistors
GLOBALFOUNDRIES INC12 citations81
US9953873B2Apr 24, 2018
Methods of modulating the morphology of epitaxial semiconductor material
GLOBALFOUNDRIES INC0 citations42