Inventor
SHIE TUNG-HENG
TW4 patents
Patents
4 patentsUS6696356B2Feb 24, 2004
Method of making a bump on a substrate without ribbon residue
TAIWAN SEMICONDUCTOR MFG23 citations89
US6926818B1Aug 9, 2005
Method to enhance the adhesion between dry film and seed metal
TAIWAN SEMICONDUCTOR MFG7 citations73
US6828198B2Dec 7, 2004
System-on-chip (SOC) solutions with multiple devices by multiple poly gate trimming process
TAIWAN SEMICONDUCTOR MFG4 citations62
US7678655B2Mar 16, 2010
Spacer layer etch method providing enhanced microelectronic device performance
TAIWAN SEMICONDUCTOR MFG1 citations51