Inventor
FUJISAWA HIROMI
JP6 patents
Patents
6 patentsUS6933608B2Aug 23, 2005
Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
KAIJO KK144 citations96
US7262124B2Aug 28, 2007
Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
KAIJO KK118 citations95
US7815095B2Oct 19, 2010
Wire loop, semiconductor device having same and wire bonding method
KAIJO KK35 citations89
US7748599B2Jul 6, 2010
Wire bonding method, wire bonding apparatus, and wire bonding control program
KAIJO KK8 citations78
US8016182B2Sep 13, 2011
Wire loop, semiconductor device having same and wire bonding method
KAIJO KK8 citations73
US8042725B2Oct 25, 2011
Wire bonding method, wire bonding apparatus, and wire bonding control program
KAIJO KK1 citations46