Inventor
HAYASHI KEI
JP9 patents
⚠️ This page may combine multiple inventors who share the name “HAYASHI KEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
4 patentsUS11450592B2Sep 20, 2022
Semiconductor package with a plurality of chips having a groove in the encapsulation
MITSUBISHI ELECTRIC CORP0 citations60
US12517167B2Jan 6, 2026
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations51
US9843318B2Dec 12, 2017
Buffer circuit
MITSUBISHI ELECTRIC CORP1 citations51
US10193323B2Jan 29, 2019
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations38