Inventor
WANG JO-MEI
TW5 patents
Patents
5 patentsUS9922939B2Mar 20, 2018
Wafer level shielding in multi-stacked fan out packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9659878B2May 23, 2017
Wafer level shielding in multi-stacked fan out packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US10177032B2Jan 8, 2019
Devices, packaging devices, and methods of packaging semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations72
US9941248B2Apr 10, 2018
Package structures, pop devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10276542B2Apr 30, 2019
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71