Inventor
IYER APARNA
US17 patents
⚠️ This page may combine multiple inventors who share the name “IYER APARNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
8 patentsUS9177864B2Nov 3, 2015
Method of coating water soluble mask for laser scribing and plasma etch
APPLIED MATERIALS INC5 citations84
US8980726B2Mar 17, 2015
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers
APPLIED MATERIALS INC6 citations73
US9105710B2Aug 11, 2015
Wafer dicing method for improving die packaging quality
APPLIED MATERIALS INC2 citations63
US8975162B2Mar 10, 2015
Wafer dicing from wafer backside
APPLIED MATERIALS INC2 citations63
US10692765B2Jun 23, 2020
Transfer arm for film frame substrate handling during plasma singulation of wafers
APPLIED MATERIALS INC1 citations62
US9236305B2Jan 12, 2016
Wafer dicing with etch chamber shield ring for film frame wafer applications
APPLIED MATERIALS INC2 citations62
US11195756B2Dec 7, 2021
Proximity contact cover ring for plasma dicing
APPLIED MATERIALS INC0 citations52
US9343366B2May 17, 2016
Dicing wafers having solder bumps on wafer backside
APPLIED MATERIALS INC1 citations52
LEI WEI-SHENG
5 patentsUS8912078B1Dec 16, 2014
Dicing wafers having solder bumps on wafer backside
LEI WEI-SHENG13 citations84
US8951819B2Feb 10, 2015
Wafer dicing using hybrid split-beam laser scribing process with plasma etch
LEI WEI-SHENG6 citations73
US8859397B2Oct 14, 2014
Method of coating water soluble mask for laser scribing and plasma etch
LEI WEI-SHENG4 citations73
US9275902B2Mar 1, 2016
Dicing processes for thin wafers with bumps on wafer backside
LEI WEI-SHENG2 citations63
US8940619B2Jan 27, 2015
Method of diced wafer transportation
LEI WEI-SHENG3 citations63