Inventor

YALAMANCHILI MADHAVA RAO

US39 patents

⚠️ This page may combine multiple inventors who share the name “YALAMANCHILI MADHAVA RAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YALAMANCHILI MADHAVA RAO

APPLIED MATERIALS INC

Wafer dicing using femtosecond-based laser and plasma etch

Laser, plasma etch, and backside grind process for wafer dicing

Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach

Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application

Method of coating water soluble mask for laser scribing and plasma etch

Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film

Wafer dicing used hybrid multi-step laser scribing process with plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch

Multi-step and asymmetrically shaped laser beam scribing

Laser scribing and plasma etch for high die break strength and clean sidewall

Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers

Laser and plasma etch wafer dicing using UV-curable adhesive film

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing method for improving die packaging quality

Wafer dicing from wafer backside

Wafer dicing using hybrid multi-step laser scribing process with plasma etch

Plasma etching of mask materials

Wafer dicing using femtosecond-based laser and plasma etch

Laser and plasma etch wafer dicing using water-soluble die attach film

Hybrid laser and plasma etch wafer dicing using substrate carrier

LEI WEI-SHENG

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean

Laser and plasma etch wafer dicing using water-soluble die attach film

Water soluble mask for substrate dicing by laser and plasma etch

Multi-step and asymmetrically shaped laser beam scribing

Water soluble mask for substrate dicing by laser and plasma etch

Wafer dicing using hybrid split-beam laser scribing process with plasma etch

Method of coating water soluble mask for laser scribing and plasma etch

Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch

Laser and plasma etch wafer dicing using physically-removable mask

YALAMANCHILI MADHAVA RAO

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

CHOWDHURY MOHAMMAD KAMRUZZAMAN

Uniform masking for wafer dicing using laser and plasma etch

SINGH SARAVJEET

Hybrid laser and plasma etch wafer dicing using substrate carrier

DINEV JIVKO

Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamber