Inventor · disambiguated record
Benoit Besancon
Also filed as: BESANCON BENOIT
8 granted patents·4 pending applications·18 citations·filing 2016–2020
80Inventor score
Top patents by PatentIndex Score
12 records- 0193US11688815B2Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jun 27, 2023·4 cites·22 claims
- 0289US9870947B1Method for collective (wafer-scale) fabrication of electronic devices and electronic deviceSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2017·Granted Jan 16, 2018·8 cites·19 claims
- 0387US9818664B2Electronic device comprising an encapsulating block locally of smaller thicknessSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Granted Nov 14, 2017·6 cites·12 claims
- 0458US10833208B2Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Nov 10, 2020·0 cites·12 claims
- 0555US11114312B2Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Sep 7, 2021·0 cites·17 claims
- 0652US10483408B2Method for making a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Nov 19, 2019·0 cites·31 claims
- 0751US10186466B2Electronic device comprising an encapsulating block locally of smaller thicknessST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Jan 22, 2019·0 cites·4 claims
- 0850US10325784B2Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Jun 18, 2019·0 cites·12 claims
- 0935US2018190511A1Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Application pending·0 cites
- 1031US2017345805A1Package including stacked die and passive componentSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
- 1131US2017317059A1Electronic device with electronic chips and heat sinkSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
- 1228US2017127567A1Electronic device equipped with a heat sinkSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
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