Inventor
KODAMA MUNEHISA
JP9 patents
Patents
9 patentsUS11120985B2Sep 14, 2021
Substrate transfer device, substrate processing system, substrate processing method and computer-readable recording medium
TOKYO ELECTRON LTD4 citations69
US11417543B2Aug 16, 2022
Bonding apparatus and bonding method
TOKYO ELECTRON LTD1 citations60
US11817337B2Nov 14, 2023
Substrate processing system and substrate processing method
TOKYO ELECTRON LTD1 citations58
US12529556B2Jan 20, 2026
Thickness measuring device and thickness measuring method to measure thickness of substrate
TOKYO ELECTRON LTD0 citations50
US12191153B2Jan 7, 2025
Substrate processing apparatus, substrate processing system and substrate processing method
TOKYO ELECTRON LTD0 citations50
US11858092B2Jan 2, 2024
Substrate processing system, substrate processing method and computer-readable recording medium
TOKYO ELECTRON LTD0 citations50
US12142483B2Nov 12, 2024
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations49
US11929268B2Mar 12, 2024
Substrate processing system, substrate processing method and computer-readable recording medium
TOKYO ELECTRON LTD0 citations48
US10833045B2Nov 10, 2020
Substrate processing apparatus and manufacturing method of substrate holding unit
TOKYO ELECTRON LTD0 citations40