Inventor
MOTSIFF WILLIAM THOMAS
US14 patents
Patents
14 patentsUS5883435AMar 16, 1999
Personalization structure for semiconductor devices
IBM316 citations98
US6440834B2Aug 27, 2002
Method and structure for a semiconductor fuse
IBM44 citations96
US5795819AAug 18, 1998
Integrated pad and fuse structure for planar copper metallurgy
IBM49 citations94
US6249038B1Jun 19, 2001
Method and structure for a semiconductor fuse
IBM28 citations92
US6093630AJul 25, 2000
Semi-conductor personalization structure and method
IBM36 citations92
US5897336AApr 27, 1999
Direct chip attach for low alpha emission interconnect system
IBM42 citations92
US6340630B1Jan 22, 2002
Method for making interconnect for low temperature chip attachment
IBM28 citations91
US6127735AOct 3, 2000
Interconnect for low temperature chip attachment
IBM41 citations91
US5731624AMar 24, 1998
Integrated pad and fuse structure for planar copper metallurgy
IBM37 citations91
US6958540B2Oct 25, 2005
Dual damascene interconnect structures having different materials for line and via conductors
IBM29 citations90
US5719070AFeb 17, 1998
Metallization composite having nickel intermediate/interface
IBM49 citations89
US7704876B2Apr 27, 2010
Dual damascene interconnect structures having different materials for line and via conductors
IBM1 citations60
US7300867B2Nov 27, 2007
Dual damascene interconnect structures having different materials for line and via conductors
IBM3 citations60
US6605526B1Aug 12, 2003
Wirebond passivation pad connection using heated capillary
IBM4 citations60