Inventor
CHAO TE-TSUNG
TW7 patents
⚠️ This page may combine multiple inventors who share the name “CHAO TE-TSUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
4 patentsUS6291898B1Sep 18, 2001
Ball grid array package
ADVANCED SEMICONDUCTOR ENG62 citations92
US6405357B1Jun 11, 2002
Method for positioning bond pads in a semiconductor die
ADVANCED SEMICONDUCTOR ENG33 citations90
US6468813B1Oct 22, 2002
Method of automatically identifying and skipping defective work pieces for wire-bonding operation
ADVANCED SEMICONDUCTOR ENG13 citations71
US6391759B1May 21, 2002
Bonding method which prevents wire sweep and the wire structure thereof
ADVANCED SEMICONDUCTOR ENG13 citations71
TAIWAN SEMICONDUCTOR MFG
3 patentsUS7116002B2Oct 3, 2006
Overhang support for a stacked semiconductor device, and method of forming thereof
TAIWAN SEMICONDUCTOR MFG34 citations90
US6849523B2Feb 1, 2005
Process for separating dies on a wafer
TAIWAN SEMICONDUCTOR MFG17 citations76
US7588963B2Sep 15, 2009
Method of forming overhang support for a stacked semiconductor device
TAIWAN SEMICONDUCTOR MFG4 citations60