Inventor · disambiguated record
Tae-Sub Chang
Also filed as: CHANG TAE-SUB
2 granted patents·3 pending applications·124 citations·filing 2001–2013
65Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
5 records- 0193US6608377B2Wafer level package including ground metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 19, 2003·118 cites·20 claims
- 0251US6605876B2Semiconductor chip package and connection structure including a ground metal plane having blank patternsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 12, 2003·6 cites·14 claims
- 0342US2014141569A1Semiconductor devices having through-via and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0433US2002084107A1High frequency semiconductor chip package and substrateSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
- 0532US2005127487A1Semiconductor package with improved solder joint reliabilityFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →