Inventor
NGUYEN HIEN D
US5 patents
⚠️ This page may combine multiple inventors who share the name “NGUYEN HIEN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MAXIM INTEGRATED PRODUCTS
4 patentsUS8860222B2Oct 14, 2014
Techniques for wafer-level processing of QFN packages
MAXIM INTEGRATED PRODUCTS2 citations59
US10032749B2Jul 24, 2018
Three-dimensional chip-to-wafer integration
MAXIM INTEGRATED PRODUCTS0 citations50
US9472451B2Oct 18, 2016
Technique for wafer-level processing of QFN packages
MAXIM INTEGRATED PRODUCTS0 citations50
US9219043B2Dec 22, 2015
Wafer-level package device having high-standoff peripheral solder bumps
MAXIM INTEGRATED PRODUCTS0 citations50