Inventor

PATTEN RICHARD

DE19 patents

⚠️ This page may combine multiple inventors who share the name “PATTEN RICHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PATTEN RICHARD

INTEL CORP

Method, apparatus and system to interconnect packaged integrated circuit dies

Package stacking using chip to wafer bonding

Package stacking using chip to wafer bonding

Fan out packaging pop mechanical attach method

Method, apparatus and system to interconnect packaged integrated circuit dies

Integrated circuit package having wirebonded multi-die stack

Integrated circuit package having wirebonded multi-die stack

Electronic device package

Fan out packaging pop mechanical attach method

Microelectronic packages with high integration microelectronic dice stack

Wafer level package structure with internal conductive layer

Integrated circuit package having wirebonded multi-die stack

INTEL IP CORP

Integrated circuit packages including an optical redistribution layer

Microelectronic packages with high integration microelectronic dice stack

Microelectronic packages with high integration microelectronic dice stack

Wafer level package structure with internal conductive layer

Semiconductor die package with more than one hanging die

Integrated circuit packages including an optical redistribution layer

Microelectronic package with illuminated backside exterior