Inventor
THOMPSON RAYMOND W
US4 patents
Patents
4 patentsUS6396136B2May 28, 2002
Ball grid package with multiple power/ground planes
TEXAS INSTRUMENTS INC87 citations96
US5777382AJul 7, 1998
Plastic packaging for a surface mounted integrated circuit
TEXAS INSTRUMENTS INC42 citations89
US4540226ASep 10, 1985
Intelligent electronic connection socket
TEXAS INSTRUMENTS INC47 citations89
US5976914ANov 2, 1999
Method of making plastic package for a surface mounted integrated circuit
TEXAS INSTRUMENTS INC1 citations48