Inventor
HO CHENG-YING
TW27 patents
⚠️ This page may combine multiple inventors who share the name “HO CHENG-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
23 patentsUS9449914B2Sep 20, 2016
Stacked integrated circuits with redistribution lines
TAIWAN SEMICONDUCTOR MFG CO LTD21 citations92
US9806119B2Oct 31, 2017
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10269768B2Apr 23, 2019
Stacked integrated circuits with redistribution lines
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US9666566B1May 30, 2017
3DIC structure and method for hybrid bonding semiconductor wafers
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US11837595B2Dec 5, 2023
Semiconductor device structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10510792B2Dec 17, 2019
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9536920B2Jan 3, 2017
Stacked image sensor having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10629568B2Apr 21, 2020
Stacked integrated circuits with redistribution lines
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12482791B2Nov 25, 2025
Stacked integrated circuits with redistribution lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12396283B2Aug 19, 2025
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923338B2Mar 5, 2024
Stacked integrated circuits with redistribution lines
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11532661B2Dec 20, 2022
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11088192B2Aug 10, 2021
Metal block and bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10297631B2May 21, 2019
Metal block and bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12557423B2Feb 17, 2026
Image-sensor structure and method of making thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12514009B2Dec 30, 2025
Isolation structure configured to reduce cross talk in image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10818720B2Oct 27, 2020
Stacked image sensor having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10522525B2Dec 31, 2019
Semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10283547B2May 7, 2019
Stacked image sensor having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9818735B2Nov 14, 2017
Method of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9437578B2Sep 6, 2016
Stacked IC control through the use of homogenous region
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9887182B2Feb 6, 2018
3DIC structure and method for hybrid bonding semiconductor wafers
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US12550473B2Feb 10, 2026
Back-trench isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49