Inventor
TESSLER CHRISTOPHER LEE
US7 patents
⚠️ This page may combine multiple inventors who share the name “TESSLER CHRISTOPHER LEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS6892781B2May 17, 2005
Method and apparatus for application of pressure to a workpiece by thermal expansion
IBM38 citations89
US6259148B1Jul 10, 2001
Modular high frequency integrated circuit structure
IBM21 citations88
US6413868B1Jul 2, 2002
Modular high frequency integrated circuit structure
IBM13 citations69
US6765152B2Jul 20, 2004
Multichip module having chips on two sides
IBM9 citations67
US6973715B2Dec 13, 2005
Method of forming a multichip module having chips on two sides
IBM0 citations46