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Inventor
QIU SHUNAN
CN
3 patents
Patents
3 patents
US8692387B2
Apr 8, 2014
Stacked die semiconductor package
QIU SHUNAN
5 citations
65
US8643156B2
Feb 4, 2014
Lead frame for assembling semiconductor device
QIU SHUNAN
1 citations
47
US8643153B2
Feb 4, 2014
Semiconductor device with staggered leads
QIU SHUNAN
0 citations
45