Inventor
OI KIYOSHI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “OI KIYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
24 patentsUS7536780B2May 26, 2009
Method of manufacturing wiring substrate to which semiconductor chip is mounted
SHINKO ELECTRIC IND CO30 citations92
US7319049B2Jan 15, 2008
Method of manufacturing an electronic parts packaging structure
SHINKO ELECTRIC IND CO40 citations92
US9859201B2Jan 2, 2018
Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
SHINKO ELECTRIC IND CO18 citations86
US7678612B2Mar 16, 2010
Method of manufacturing semiconductor device
SHINKO ELECTRIC IND CO8 citations84
US7414309B2Aug 19, 2008
Encapsulated electronic part packaging structure
SHINKO ELECTRIC IND CO12 citations84
US7928557B2Apr 19, 2011
Stacked package and method for manufacturing the package
SHINKO ELECTRIC IND CO12 citations83
US7403370B2Jul 22, 2008
Capacitor parts
SHINKO ELECTRIC IND CO8 citations74
US7375022B2May 20, 2008
Method of manufacturing wiring board
SHINKO ELECTRIC IND CO8 citations74
US7229856B2Jun 12, 2007
Method of manufacturing electronic part packaging structure
SHINKO ELECTRIC IND CO7 citations74
US9622347B2Apr 11, 2017
Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor device
SHINKO ELECTRIC IND CO3 citations73
US9530744B2Dec 27, 2016
Semiconductor device and method of manufacturing the same
SHINKO ELECTRIC IND CO4 citations73
US9307641B2Apr 5, 2016
Wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO6 citations73
US9997450B2Jun 12, 2018
Wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO6 citations71
US11817381B2Nov 14, 2023
Semiconductor device
SHINKO ELECTRIC IND CO2 citations68
US7859121B2Dec 28, 2010
Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same
SHINKO ELECTRIC IND CO2 citations63
US7768140B2Aug 3, 2010
Semiconductor device
SHINKO ELECTRIC IND CO2 citations63
US7678681B2Mar 16, 2010
Electronic component built-in substrate and method of manufacturing the same
SHINKO ELECTRIC IND CO4 citations63
US7284307B2Oct 23, 2007
Method for manufacturing wiring board
SHINKO ELECTRIC IND CO6 citations63
US7358591B2Apr 15, 2008
Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
SHINKO ELECTRIC IND CO5 citations62
US9048331B2Jun 2, 2015
Method of manufacturing semiconductor device
SHINKO ELECTRIC IND CO2 citations61
US8017503B2Sep 13, 2011
Manufacturing method of semiconductor package
SHINKO ELECTRIC IND CO3 citations61
US12185470B2Dec 31, 2024
Embedded printed circuit board
SHINKO ELECTRIC IND CO0 citations50
US11706877B2Jul 18, 2023
Composite wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO0 citations47
US7963031B2Jun 21, 2011
Package for semiconductor device and method of manufacturing the same
SHINKO ELECTRIC IND CO0 citations42
OI KIYOSHI
2 patentsUS8669653B2Mar 11, 2014
Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor
OI KIYOSHI14 citations82
US8138018B2Mar 20, 2012
Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board
OI KIYOSHI2 citations60