P

Inventor

LUCE STEPHEN E

US53 patents
⚠️ This page may combine multiple inventors who share the name “LUCE STEPHEN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

42 patents
US5985762ANov 16, 1999

Method of forming a self-aligned copper diffusion barrier in vias

IBM284 citations99
US7781781B2Aug 24, 2010

CMOS imager array with recessed dielectric

IBM65 citations98
US6153043ANov 28, 2000

Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing

IBM122 citations97
US5219788AJun 15, 1993

Bilayer metallization cap for photolithography

IBM425 citations97
US7335577B2Feb 26, 2008

Crack stop for low K dielectrics

IBM47 citations95
US7521798B2Apr 21, 2009

Stacked imager package

IBM13 citations93
US7361989B1Apr 22, 2008

Stacked imager package

IBM26 citations93
US7015150B2Mar 21, 2006

Exposed pore sealing post patterning

IBM42 citations93
US5384281AJan 24, 1995

Non-conformal and oxidizable etch stops for submicron features

IBM31 citations93
US5486267AJan 23, 1996

Method for applying photoresist

IBM24 citations92
US5480748AJan 2, 1996

Protection of aluminum metallization against chemical attack during photoresist development

IBM29 citations92
US7521336B2Apr 21, 2009

Crack stop for low K dielectrics

IBM22 citations91
US6251787B1Jun 26, 2001

Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing

IBM38 citations91
US4944682AJul 31, 1990

Method of forming borderless contacts

IBM36 citations91
US6426557B1Jul 30, 2002

Self-aligned last-metal C4 interconnection layer for Cu technologies

IBM26 citations87
US10941036B2Mar 9, 2021

Method of manufacturing MEMS switches with reduced switching voltage

IBM2 citations84
US8921201B2Dec 30, 2014

Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure

IBM7 citations84
US7541679B2Jun 2, 2009

Exposed pore sealing post patterning

IBM5 citations74
US6762108B2Jul 13, 2004

Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed

IBM5 citations73
US6504203B2Jan 7, 2003

Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed

IBM12 citations73
US9059396B2Jun 16, 2015

Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structure

IBM2 citations63
US7824961B2Nov 2, 2010

Stacked imager package

IBM3 citations63
US7183656B2Feb 27, 2007

Bilayer aluminum last metal for interconnects and wirebond pads

IBM4 citations63
US5521434AMay 28, 1996

Semiconductor chip and electronic module with integrated surface interconnects/components

IBM3 citations63
US7087997B2Aug 8, 2006

Copper to aluminum interlayer interconnect using stud and via liner

IBM4 citations61
US7037824B2May 2, 2006

Copper to aluminum interlayer interconnect using stud and via liner

IBM2 citations61
US10836632B2Nov 17, 2020

Method of manufacturing MEMS switches with reduced switching voltage

IBM0 citations52
US10745273B2Aug 18, 2020

Method of manufacturing a switch

IBM0 citations52
US10647569B2May 12, 2020

Methods of manufacture for MEMS switches with reduced switching voltage

IBM0 citations52
US10640373B2May 5, 2020

Methods of manufacturing for MEMS switches with reduced switching voltage

IBM0 citations52
US10017383B2Jul 10, 2018

Method of manufacturing MEMS switches with reduced switching voltage

IBM0 citations52
US9944518B2Apr 17, 2018

Method of manufacture MEMS switches with reduced voltage

IBM0 citations52
US9944517B2Apr 17, 2018

Method of manufacturing MEMS switches with reduced switching volume

IBM0 citations52
US9847415B2Dec 19, 2017

Field effect transistor and method of manufacture

IBM1 citations52
US9824834B2Nov 21, 2017

Method of manufacturing MEMS switches with reduced voltage

IBM0 citations52
US9718681B2Aug 1, 2017

Method of manufacturing a switch

IBM0 citations52
US9287075B2Mar 15, 2016

MEMS switches with reduced switching voltage and methods of manufacture

IBM0 citations52
US9172025B2Oct 27, 2015

Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structure

IBM0 citations52
US9059131B2Jun 16, 2015

Charge breakdown avoidance for MIM elements in SOI base technology and method

IBM0 citations52
US9019049B2Apr 28, 2015

MEMS switches with reduced switching voltage and methods of manufacture

IBM0 citations52
US8689152B2Apr 1, 2014

Double-sided integrated circuit chips

IBM0 citations52
US8044764B2Oct 25, 2011

Resistor and design structure having resistor material length with sub-lithographic width

IBM0 citations52

LUCE STEPHEN E

2 patents

HAKEY MARK C

2 patents

HARAME DAVID L

1 patent

BERNSTEIN KERRY

1 patent

CLARK JR WILLIAM F

1 patent

BOTULA ALAN B

1 patent

Showing the top 50 of 53 patents by PatentIndex Score.