Inventor · disambiguated record
Sayaka Wakioka
Also filed as: WAKIOKA SAYAKA
7 granted patents·2 pending applications·6 citations·filing 2010–2019
74Inventor score
Top patents by PatentIndex Score
9 records- 0176US9209155B2Method for manufacturing semiconductor device and adhesive for mounting flip chipSEKISUI CHEMICAL CO LTD·Filed 2013·Granted Dec 8, 2015·4 cites·11 claims
- 0262US9748195B2Adhesive for mounting flip chip for use in a method for producing a semiconductor deviceSEKISUI CHEMICAL CO LTD·Filed 2015·Granted Aug 29, 2017·1 cites·12 claims
- 0351US8692394B2Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor deviceLEE YANGSOO·Filed 2010·Granted Apr 8, 2014·1 cites·20 claims
- 0450US12139576B2Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring boardSEKISUI CHEMICAL CO LTD·Filed 2019·Granted Nov 12, 2024·0 cites·14 claims
- 0546US11802177B2Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agentSEKISUI CHEMICAL CO LTD·Filed 2018·Granted Oct 31, 2023·0 cites·15 claims
- 0639US11421107B2Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit boardSEKISUI CHEMICAL CO LTD·Filed 2018·Granted Aug 23, 2022·0 cites·20 claims
- 0736US11101052B2Conductive material, connection structure and method for producing connection structureSEKISUI CHEMICAL CO LTD·Filed 2017·Granted Aug 24, 2021·0 cites·11 claims
- 0832US2012326301A1Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor deviceWAKIOKA SAYAKA·Filed 2011·Application pending·0 cites
- 0929US2016272854A1Adhesive for mounting electronic component and adhesive film for mounting flip chipSEKISUI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →