P

Inventor

TOPALOGLU RASIT O

US44 patents
⚠️ This page may combine multiple inventors who share the name “TOPALOGLU RASIT O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

36 patents
US10068184B1Sep 4, 2018

Vertical superconducting capacitors for transmon qubits

IBM43 citations98
US9947660B1Apr 17, 2018

Two dimension material fin sidewall

IBM15 citations92
US10312200B2Jun 4, 2019

Integrated circuit security

IBM5 citations84
US10103144B1Oct 16, 2018

Two dimension material fin sidewall

IBM4 citations84
US10916253B2Feb 9, 2021

Spoken microagreements with blockchain

IBM4 citations73
US10840295B2Nov 17, 2020

Fluxonium qubits and devices including plurality of vertical stacks of Josephson junctions

IBM3 citations73
US10665635B1May 26, 2020

Persistent flux biasing methodology for superconducting loops

IBM5 citations73
US10573606B2Feb 25, 2020

Integrated circuit security

IBM2 citations73
US10559564B2Feb 11, 2020

Two dimension material fin sidewall

IBM1 citations73
US10552758B2Feb 4, 2020

Vertical superconducting capacitors for transmon qubits

IBM1 citations73
US10529908B2Jan 7, 2020

Backside coupling with superconducting partial TSV for transmon qubits

IBM2 citations73
US10446736B2Oct 15, 2019

Backside coupling with superconducting partial TSV for transmon qubits

IBM2 citations73
US10103145B1Oct 16, 2018

Two dimension material fin sidewall

IBM2 citations73
US9859208B1Jan 2, 2018

Bottom self-aligned via

IBM2 citations73
US9837491B2Dec 5, 2017

Stacked carbon nanotube multiple threshold device

IBM3 citations73
US9373538B2Jun 21, 2016

Interconnect level structures for confining stitch-induced via structures

IBM3 citations73
US8806393B1Aug 12, 2014

Generation of design shapes for confining stitch-induced via structures

IBM6 citations73
US10796949B2Oct 6, 2020

Airgap vias in electrical interconnects

IBM2 citations71
US10896883B2Jan 19, 2021

Integrated circuit security

IBM0 citations62
US11011415B2May 18, 2021

Airgap vias in electrical interconnects

IBM0 citations60
US11593470B2Feb 28, 2023

Volumetric display-based CAPTCHA system

IBM0 citations52
US10804454B2Oct 13, 2020

Backside coupling with superconducting partial TSV for transmon qubits

IBM0 citations52
US10445651B2Oct 15, 2019

Vertical superconducting capacitors for transmon qubits

IBM0 citations52
US10169525B2Jan 1, 2019

Multiple-depth trench interconnect technology at advanced semiconductor nodes

IBM0 citations52
US10170474B2Jan 1, 2019

Two dimension material fin sidewall

IBM0 citations52
US10152567B2Dec 11, 2018

Early overlay prediction and overlay-aware mask design

IBM0 citations52
US9940429B2Apr 10, 2018

Early overlay prediction and overlay-aware mask design

IBM0 citations52
US9710592B2Jul 18, 2017

Multiple-depth trench interconnect technology at advanced semiconductor nodes

IBM0 citations52
US9601367B2Mar 21, 2017

Interconnect level structures for confining stitch-induced via structures

IBM0 citations52
US9424388B2Aug 23, 2016

Dividing lithography exposure fields to improve semiconductor fabrication

IBM0 citations52
US11487508B2Nov 1, 2022

Magnetic tunnel junction based true random number generator

IBM0 citations50
US10394992B2Aug 27, 2019

Wire lineend to via overlap optimization

IBM0 citations42
US10142335B2Nov 27, 2018

Dynamic intrinsic chip identification

IBM0 citations42
US9569578B1Feb 14, 2017

Mask decomposition and optimization for directed self assembly

IBM0 citations42
US9454631B2Sep 27, 2016

Stitch-derived via structures and methods of generating the same

IBM0 citations42
US9058457B2Jun 16, 2015

Reticle data decomposition for focal plane determination in lithographic processes

IBM0 citations41

TOPALOGLU RASIT O

3 patents

TESSERA LLC

2 patents

ADVANCED MICRO DEVICES INC

1 patent

INTERANTIONAL BUSINESS MACHINES CORP

1 patent

GLOBALFOUNDRIES INC

1 patent