Inventor

LIM HWAN-SIK

KR7 patents

⚠️ This page may combine multiple inventors who share the name “LIM HWAN-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US8823172B2Sep 2, 2014

Semiconductor package and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations71

US8759221B2Jun 24, 2014

Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages

SAMSUNG ELECTRONICS CO LTD0 citations50

US8928150B2Jan 6, 2015

Multi-chip package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations40

LIM HWAN-SIK

1 patent

US8680685B2Mar 25, 2014

Semiconductor package and method for fabricating the same

LIM HWAN-SIK9 citations78

KANG SUN-WON

1 patent

US8519470B2Aug 27, 2013

Semiconductor chip, and semiconductor package and system each including the semiconductor chip

KANG SUN-WON6 citations70

CHO MOON GI

1 patent

US9312213B2Apr 12, 2016

Bump structures having an extension

CHO MOON GI2 citations59

PARK JIN-WOO

1 patent

US8497569B2Jul 30, 2013

Package substrates and semiconductor packages having the same

PARK JIN-WOO0 citations50