Inventor

ONG MENG TONG

MY3 patents

Patents

3 patents

US9209152B2Dec 8, 2015

Molding material and method for packaging semiconductor chips

INFINEON TECHNOLOGIES AG5 citations67

US9054063B2Jun 9, 2015

High power single-die semiconductor package

INFINEON TECHNOLOGIES AG3 citations57

US9373609B2Jun 21, 2016

Bump package and methods of formation thereof

INFINEON TECHNOLOGIES AG0 citations41