Inventor
LAI KUO-CHIH
TW45 patents
⚠️ This page may combine multiple inventors who share the name “LAI KUO-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
36 patentsUS7378343B2May 27, 2008
Dual damascence process utilizing teos-based silicon oxide cap layer having reduced carbon content
UNITED MICROELECTRONICS CORP20 citations91
US9679813B2Jun 13, 2017
Semiconductor structure and process for forming plug including layer with pulled back sidewall part
UNITED MICROELECTRONICS CORP9 citations84
US9659937B2May 23, 2017
Semiconductor process of forming metal gates with different threshold voltages and semiconductor structure thereof
UNITED MICROELECTRONICS CORP14 citations83
US10074725B1Sep 11, 2018
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP5 citations82
US9755047B2Sep 5, 2017
Semiconductor process and semiconductor device
UNITED MICROELECTRONICS CORP2 citations73
US9640482B1May 2, 2017
Semiconductor device with a contact plug and method of fabricating the same
UNITED MICROELECTRONICS CORP6 citations72
US8598033B1Dec 3, 2013
Method for forming a salicide layer
UNITED MICROELECTRONICS CORP6 citations72
US10756128B2Aug 25, 2020
Integrated circuit device and method of fabricating integrated circuit
UNITED MICROELECTRONICS CORP5 citations71
US9728467B2Aug 8, 2017
Method for modulating work function of semiconductor device having metal gate structure by gas treatment
UNITED MICROELECTRONICS CORP3 citations71
US8350246B2Jan 8, 2013
Structure of porous low-k layer and interconnect structure
UNITED MICROELECTRONICS CORP2 citations63
US7947565B2May 24, 2011
Forming method of porous low-k layer and interconnect process
UNITED MICROELECTRONICS CORP4 citations63
US12211888B2Jan 28, 2025
Method for forming a thin film resistor with improved thermal stability
UNITED MICROELECTRONICS CORP0 citations61
US11139384B2Oct 5, 2021
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP0 citations61
US12274087B2Apr 8, 2025
Field effect transistor and fabrication method thereof
UNITED MICROELECTRONICS CORP0 citations60
US11424408B2Aug 23, 2022
ReRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US11165019B2Nov 2, 2021
ReRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US11856870B2Dec 26, 2023
MRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations59
US11404631B2Aug 2, 2022
MRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations59
US10068797B2Sep 4, 2018
Semiconductor process for forming plug
UNITED MICROELECTRONICS CORP0 citations52
US9985110B2May 29, 2018
Semiconductor process
UNITED MICROELECTRONICS CORP0 citations52
US9570348B2Feb 14, 2017
Method of forming contact strucutre
UNITED MICROELECTRONICS CORP1 citations52
US8344465B2Jan 1, 2013
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations52
US7943512B2May 17, 2011
Method for fabricating metal silicide
UNITED MICROELECTRONICS CORP1 citations52
US7803702B2Sep 28, 2010
Method for fabricating MOS transistors
UNITED MICROELECTRONICS CORP0 citations52
US10340350B2Jul 2, 2019
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations51
US9966425B1May 8, 2018
Method for fabricating a MIM capacitor
UNITED MICROELECTRONICS CORP1 citations51
US9691704B1Jun 27, 2017
Semiconductor structure and method for manufacturing the same
UNITED MICROELECTRONICS CORP0 citations51
US9685316B2Jun 20, 2017
Semiconductor process
UNITED MICROELECTRONICS CORP0 citations51
US9478628B1Oct 25, 2016
Metal gate forming process
UNITED MICROELECTRONICS CORP1 citations51
US9318338B2Apr 19, 2016
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP1 citations51
US8993390B2Mar 31, 2015
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US8877635B2Nov 4, 2014
Method for fabricating MOS transistor
UNITED MICROELECTRONICS CORP1 citations51
US10490643B2Nov 26, 2019
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations50
US10290710B2May 14, 2019
Semiconductor device and method for forming the same
UNITED MICROELECTRONICS CORP0 citations50
US7670438B2Mar 2, 2010
Method of removing particles from wafer
UNITED MICROELECTRONICS CORP0 citations49
US9576803B2Feb 21, 2017
Method for tuning metal gate work function before contact formation in fin-shaped field effect transistor manufacturing process
UNITED MICROELECTRONICS CORP0 citations39
LAI KUO-CHIH
3 patentsCHEN YI-WEI
3 patentsUS8067281B1Nov 29, 2011
Method of fabricating complementary metal-oxide-semiconductor (CMOS) Device
CHEN YI-WEI9 citations83
US8641828B2Feb 4, 2014
Cleaning method of semiconductor manufacturing process
CHEN YI-WEI0 citations51
US8163607B2Apr 24, 2012
Semiconductor device and method of making the same
CHEN YI-WEI1 citations51