Inventor
LINDNER FRIEDRICH PAUL
AT39 patents
⚠️ This page may combine multiple inventors who share the name “LINDNER FRIEDRICH PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EV GROUP E THALLNER GMBH
22 patentsUS10279575B2May 7, 2019
Device and method for bonding substrates
EV GROUP E THALLNER GMBH9 citations84
US9666470B2May 30, 2017
Receptacle device, device and method for handling substrate stacks
EV GROUP E THALLNER GMBH5 citations84
US11328939B2May 10, 2022
Method for prefixing of substrates
EV GROUP E THALLNER GMBH1 citations73
US11059280B2Jul 13, 2021
Device and method for bonding substrates
EV GROUP E THALLNER GMBH2 citations73
US10971378B2Apr 6, 2021
Method and device for bonding substrates
EV GROUP E THALLNER GMBH2 citations73
US10438822B2Oct 8, 2019
Method for prefixing of substrates
EV GROUP E THALLNER GMBH3 citations73
US10340161B2Jul 2, 2019
Device for prefixing of substrates
EV GROUP E THALLNER GMBH1 citations73
US10014193B2Jul 3, 2018
Method and device for bonding substrates
EV GROUP E THALLNER GMBH3 citations73
US10239253B2Mar 26, 2019
Method for embossing of substrates
EV GROUP E THALLNER GMBH2 citations72
US9941149B2Apr 10, 2018
Receptacle device, device and method for handling substrate stacks
EV GROUP E THALLNER GMBH1 citations63
US12062521B2Aug 13, 2024
Method for prefixing of substrates
EV GROUP E THALLNER GMBH0 citations62
US11697281B2Jul 11, 2023
Device and method for bonding substrates
EV GROUP E THALLNER GMBH0 citations62
US11020953B2Jun 1, 2021
Device and method for bonding substrates
EV GROUP E THALLNER GMBH0 citations62
US11020952B2Jun 1, 2021
Device and method for bonding substrates
EV GROUP E THALLNER GMBH0 citations62
US11020951B2Jun 1, 2021
Device and method for bonding substrates
EV GROUP E THALLNER GMBH0 citations62
US11020950B2Jun 1, 2021
Device and method for bonding substrates
EV GROUP E THALLNER GMBH0 citations62
US12283491B2Apr 22, 2025
Method for producing singulated encapsulated components
EV GROUP E THALLNER GMBH0 citations60
US12199062B2Jan 14, 2025
Device and method for the alignment of substrates
EV GROUP E THALLNER GMBH0 citations56
US11472212B2Oct 18, 2022
Device and method for embossing micro- and/or nanostructures
EV GROUP E THALLNER GMBH0 citations54
US10347523B2Jul 9, 2019
Receptacle device, device and method for handling substrate stacks
EV GROUP E THALLNER GMBH0 citations52
US9653329B2May 16, 2017
Semiconductor treating device and method
EV GROUP E THALLNER GMBH0 citations52
US9984942B2May 29, 2018
Method and device for leveling a substrate stack
EV GROUP E THALLNER GMBH0 citations41
EV GROUP GMBH
8 patentsUS9381732B2Jul 5, 2016
Device for stripping a product substrate from a carrier substrate
EV GROUP GMBH9 citations83
US9138978B2Sep 22, 2015
Device for separating a substrate from a carrier substrate
EV GROUP GMBH1 citations52
US9457552B2Oct 4, 2016
Method for detaching a product substrate off a carrier substrate
EV GROUP GMBH0 citations51
US9381729B2Jul 5, 2016
Device for detaching a product substrate off a carrier substrate
EV GROUP GMBH0 citations51
US9186877B2Nov 17, 2015
Method for stripping a product substrate from a carrier substrate
EV GROUP GMBH0 citations51
US8986496B2Mar 24, 2015
Device and method for stripping a product substrate from a carrier substrate
EV GROUP GMBH0 citations51
US9449863B2Sep 20, 2016
Device for aligning and pre-fixing a wafer
EV GROUP GMBH0 citations48
US9771223B2Sep 26, 2017
Device and method for processing of wafers
EV GROUP GMBH0 citations43
LINDNER FRIEDRICH PAUL
5 patentsUS9116424B2Aug 25, 2015
Device for embossing of substrates
LINDNER FRIEDRICH PAUL2 citations60
US8894807B2Nov 25, 2014
Device and method for detaching a semiconductor wafer from a substrate
LINDNER FRIEDRICH PAUL3 citations60
US8763239B2Jul 1, 2014
System for uniform structuring of substrates
LINDNER FRIEDRICH PAUL2 citations60
US8931624B2Jan 13, 2015
Transport system for accommodating and transporting flexible substrates
LINDNER FRIEDRICH PAUL0 citations49
US9751698B2Sep 5, 2017
Device and method for processing wafers
LINDNER FRIEDRICH PAUL0 citations42