Inventor
TIEN YUN-HSIANG
TW6 patents
⚠️ This page may combine multiple inventors who share the name “TIEN YUN-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
5 patentsUS7125745B2Oct 24, 2006
Multi-chip package substrate for flip-chip and wire bonding
ADVANCED SEMICONDUCTOR ENG26 citations92
US6921981B2Jul 26, 2005
Ball grid array package
ADVANCED SEMICONDUCTOR ENG14 citations80
US7091583B2Aug 15, 2006
Method and structure for prevention leakage of substrate strip
ADVANCED SEMICONDUCTOR ENG10 citations69
US11670836B2Jun 6, 2023
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations56
US9219048B2Dec 22, 2015
Substrate having pillar group and semiconductor package having pillar group
ADVANCED SEMICONDUCTOR ENG0 citations40