Inventor
HUNG KUN-TING
TW4 patents
⚠️ This page may combine multiple inventors who share the name “HUNG KUN-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
3 patentsUS10103128B2Oct 16, 2018
Semiconductor package incorporating redistribution layer interposer
MEDIATEK INC3 citations70
US12588522B2Mar 24, 2026
Semiconductor package structure
MEDIATEK INC0 citations59
US12021068B2Jun 25, 2024
Semiconductor device with dummy thermal features on interposer
MEDIATEK INC0 citations59