Inventor

HAN KWON WHAN

KR19 patents

⚠️ This page may combine multiple inventors who share the name “HAN KWON WHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAN KWON WHAN

HYNIX SEMICONDUCTOR INC

Method for manufacturing semiconductor package

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Method for manufacturing stack package using through-electrodes

Wafer level chip scale package (WLCSP) with high reliability against thermal stress

Through-silicon via and method for forming the same

Stack package having pattern die redistribution

Wafer level semiconductor package and method for manufacturing the same

High-performance semiconductor package

Multi-layer stacked wafer level semiconductor package module

Stacked semiconductor package and method for manufacturing the same

Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same

HAN KWON WHAN

Chip carriers, semiconductor devices including the same, semiconductor packages including the same, and methods of fabricating the same

Package of electronic device including connecting bump, system including the same and method for fabricating the same

Stacked semiconductor package and method for manufacturing the same

Semiconductor chip embedded with a test circuit

Semiconductor package

Semiconductor chip capable of improving mounting reliability and semiconductor package having the same

SK HYNIX INC

Methods of fabricating semiconductor packages including reinforcement top die

PARK CHANG JUN

Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same