Inventor
SUH MIN SUK
KR31 patents
⚠️ This page may combine multiple inventors who share the name “SUH MIN SUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYNIX SEMICONDUCTOR INC
16 patentsUS7525186B2Apr 28, 2009
Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same
HYNIX SEMICONDUCTOR INC262 citations99
US7598617B2Oct 6, 2009
Stack package utilizing through vias and re-distribution lines
HYNIX SEMICONDUCTOR INC72 citations98
US7795139B2Sep 14, 2010
Method for manufacturing semiconductor package
HYNIX SEMICONDUCTOR INC47 citations94
US7859115B2Dec 28, 2010
Semiconductor package for improving characteristics for transmitting signals and power
HYNIX SEMICONDUCTOR INC21 citations92
US8358016B2Jan 22, 2013
Semiconductor package having an internal cooling system
HYNIX SEMICONDUCTOR INC5 citations84
US8018043B2Sep 13, 2011
Semiconductor package having side walls and method for manufacturing the same
HYNIX SEMICONDUCTOR INC13 citations84
US7871925B2Jan 18, 2011
Stack package and method for manufacturing the same
HYNIX SEMICONDUCTOR INC10 citations84
US7507637B2Mar 24, 2009
Method of manufacturing wafer level stack package
HYNIX SEMICONDUCTOR INC16 citations84
US7446405B2Nov 4, 2008
Wafer level chip scale package (WLCSP) with high reliability against thermal stress
HYNIX SEMICONDUCTOR INC9 citations84
US7973414B2Jul 5, 2011
Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same
HYNIX SEMICONDUCTOR INC6 citations74
US7911065B2Mar 22, 2011
Semiconductor package having a stacked wafer level package and method for fabricating the same
HYNIX SEMICONDUCTOR INC6 citations74
US8049341B2Nov 1, 2011
Semiconductor package and method for manufacturing the same
HYNIX SEMICONDUCTOR INC3 citations63
US7834463B2Nov 16, 2010
Stack package having pattern die redistribution
HYNIX SEMICONDUCTOR INC5 citations62
US8361838B2Jan 29, 2013
Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips
HYNIX SEMICONDUCTOR INC0 citations52
US7923294B2Apr 12, 2011
Semiconductor package and method for manufacturing the same for decreasing number of processes
HYNIX SEMICONDUCTOR INC0 citations52
US7732931B2Jun 8, 2010
Semiconductor package and method for manufacturing the same for decreasing number of processes
HYNIX SEMICONDUCTOR INC0 citations52
SUH MIN SUK
8 patentsUS8299592B2Oct 30, 2012
Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules
SUH MIN SUK22 citations92
US8319327B2Nov 27, 2012
Semiconductor package with stacked chips and method for manufacturing the same
SUH MIN SUK10 citations83
US8232654B2Jul 31, 2012
Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same
SUH MIN SUK10 citations83
US8159065B2Apr 17, 2012
Semiconductor package having an internal cooling system
SUH MIN SUK14 citations83
US8203217B2Jun 19, 2012
Semiconductor package having a stacked wafer level package and method for fabricating the same
SUH MIN SUK2 citations62
US8097933B2Jan 17, 2012
Flexible semiconductor package and method for fabricating the same
SUH MIN SUK3 citations62
US8524530B2Sep 3, 2013
Flexible semiconductor package and method for fabricating the same
SUH MIN SUK0 citations51
US8299582B2Oct 30, 2012
Substrate for semiconductor package and semiconductor package having the same
SUH MIN SUK0 citations51