Inventor
KIM SEONG CHEOL
KR37 patents
⚠️ This page may combine multiple inventors who share the name “KIM SEONG CHEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KIM SEONG CHEOL
10 patentsUS8478292B2Jul 2, 2013
Wireless localization method based on an efficient multilateration algorithm over a wireless sensor network and a recording medium in which a program for the method is recorded
KIM SEONG CHEOL16 citations83
US8823161B2Sep 2, 2014
Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures
KIM SEONG CHEOL3 citations62
US8803325B2Aug 12, 2014
Stacked semiconductor package
KIM SEONG CHEOL2 citations62
US8237291B2Aug 7, 2012
Stack package
KIM SEONG CHEOL3 citations62
US8232642B2Jul 31, 2012
Printed circuit board
KIM SEONG CHEOL3 citations62
US8198719B2Jun 12, 2012
Semiconductor chip and semiconductor package including the same
KIM SEONG CHEOL2 citations62
US9029602B2May 12, 2015
Anti-microbial and anti-static surface treatment agent with quaternary ammonium salt as active ingredient and method for preventing static electricity in polymer fibers using same
KIM SEONG CHEOL0 citations51
US8766457B2Jul 1, 2014
Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
KIM SEONG CHEOL1 citations51
US8399984B2Mar 19, 2013
Semiconductor package
KIM SEONG CHEOL1 citations51
US8183689B2May 22, 2012
Printed circuit board and flip chip package using the same with improved bump joint reliability
KIM SEONG CHEOL0 citations40
HYNIX SEMICONDUCTOR INC
7 patentsUS7795139B2Sep 14, 2010
Method for manufacturing semiconductor package
HYNIX SEMICONDUCTOR INC47 citations94
US7898834B2Mar 1, 2011
Semiconductor chip with chip selection structure and stacked semiconductor package having the same
HYNIX SEMICONDUCTOR INC18 citations92
US7795073B2Sep 14, 2010
Method for manufacturing stack package using through-electrodes
HYNIX SEMICONDUCTOR INC12 citations84
US7446405B2Nov 4, 2008
Wafer level chip scale package (WLCSP) with high reliability against thermal stress
HYNIX SEMICONDUCTOR INC9 citations84
US7355286B2Apr 8, 2008
Flip chip bonded package applicable to fine pitch technology
HYNIX SEMICONDUCTOR INC3 citations63
US7595255B2Sep 29, 2009
Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same
HYNIX SEMICONDUCTOR INC2 citations62
US7859102B2Dec 28, 2010
Multi-layer stacked wafer level semiconductor package module
HYNIX SEMICONDUCTOR INC1 citations52
SAMSUNG ELECTRONICS CO LTD
4 patentsUS7710377B2May 4, 2010
LCD panel including gate drivers
SAMSUNG ELECTRONICS CO LTD15 citations83
US8042020B2Oct 18, 2011
Data error correction circuit, integrated circuit for data error correction, and method of performing data error correction
SAMSUNG ELECTRONICS CO LTD2 citations63
US7333549B2Feb 19, 2008
Method and apparatus for estimating a signal sequence in a MIMO-OFDM mobile communication system
SAMSUNG ELECTRONICS CO LTD5 citations59
US10784706B2Sep 22, 2020
Wireless power transmitter and method for controlling the same
SAMSUNG ELECTRONICS CO LTD0 citations41
SEOUL NAT UNIV R&DB FOUNDATION
2 patentsUS11892558B2Feb 6, 2024
Method and apparatus for estimating direction of arrival of radar reception signal using antenna array extrapolation
SEOUL NAT UNIV R&DB FOUNDATION2 citations67
US12096237B2Sep 17, 2024
Method for predicting structure of indoor space using radio propagation channel analysis through deep learning
SEOUL NAT UNIV R&DB FOUNDATION0 citations52