Inventor
YANG SEUNG TAEK
KR30 patents
⚠️ This page may combine multiple inventors who share the name “YANG SEUNG TAEK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYNIX SEMICONDUCTOR INC
14 patentsUS7795139B2Sep 14, 2010
Method for manufacturing semiconductor package
HYNIX SEMICONDUCTOR INC47 citations94
US7859115B2Dec 28, 2010
Semiconductor package for improving characteristics for transmitting signals and power
HYNIX SEMICONDUCTOR INC21 citations92
US7429792B2Sep 30, 2008
Stack package with vertically formed heat sink
HYNIX SEMICONDUCTOR INC32 citations92
US8018043B2Sep 13, 2011
Semiconductor package having side walls and method for manufacturing the same
HYNIX SEMICONDUCTOR INC13 citations84
US7728419B2Jun 1, 2010
Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
HYNIX SEMICONDUCTOR INC13 citations84
US8049341B2Nov 1, 2011
Semiconductor package and method for manufacturing the same
HYNIX SEMICONDUCTOR INC3 citations63
US8383447B2Feb 26, 2013
Reverse image sensor module and method for manufacturing the same
HYNIX SEMICONDUCTOR INC3 citations62
US7884465B2Feb 8, 2011
Semiconductor package with passive elements embedded within a semiconductor chip
HYNIX SEMICONDUCTOR INC2 citations62
US7652347B2Jan 26, 2010
Semiconductor package having embedded passive elements and method for manufacturing the same
HYNIX SEMICONDUCTOR INC2 citations62
US7629682B2Dec 8, 2009
Wafer level package configured to compensate size difference in different types of packages
HYNIX SEMICONDUCTOR INC3 citations62
US7498199B2Mar 3, 2009
Method for fabricating semiconductor package
HYNIX SEMICONDUCTOR INC3 citations62
US7847419B2Dec 7, 2010
Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers
HYNIX SEMICONDUCTOR INC4 citations61
US8361838B2Jan 29, 2013
Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips
HYNIX SEMICONDUCTOR INC0 citations52
US7834437B2Nov 16, 2010
Semiconductor package with passive elements
HYNIX SEMICONDUCTOR INC0 citations41
SK HYNIX INC
8 patentsUS9793217B2Oct 17, 2017
Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology
SK HYNIX INC8 citations84
US9716017B2Jul 25, 2017
Semiconductor packages including interposer and methods of manufacturing the same
SK HYNIX INC2 citations72
US9257413B2Feb 9, 2016
Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same
SK HYNIX INC4 citations69
US8357959B2Jan 22, 2013
Image sensor module and method of manufacturing the same
SK HYNIX INC2 citations63
US10090252B2Oct 2, 2018
Package-on-package type semiconductor device including fan-out memory package
SK HYNIX INC0 citations52
US9418875B2Aug 16, 2016
Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof
SK HYNIX INC0 citations52
US9171813B2Oct 27, 2015
Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof
SK HYNIX INC1 citations52
US9166095B2Oct 20, 2015
Image sensor module and method of manufacturing the same
SK HYNIX INC0 citations52
YANG SEUNG TAEK
4 patentsUS8159066B2Apr 17, 2012
Semiconductor package having a heat dissipation member
YANG SEUNG TAEK9 citations82
US8178975B2May 15, 2012
Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers
YANG SEUNG TAEK9 citations81
US8154098B2Apr 10, 2012
Reverse image sensor module and method for manufacturing the same
YANG SEUNG TAEK4 citations61
US8502366B2Aug 6, 2013
Semiconductor package
YANG SEUNG TAEK1 citations51