Inventor
KIM JONG HOON
KR210 patents
⚠️ This page may combine multiple inventors who share the name “KIM JONG HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SK HYNIX INC
13 patentsUS9214410B2Dec 15, 2015
Stack packages and methods of fabricating the same
SK HYNIX INC19 citations92
US9906312B2Feb 27, 2018
Semiconductor packages with optical interconnection structures, memory cards including the same, and electronic systems including the same
SK HYNIX INC8 citations84
US9508688B2Nov 29, 2016
Semiconductor packages with interposers and methods of manufacturing the same
SK HYNIX INC9 citations84
US9911751B2Mar 6, 2018
Manufacturing method for semiconductor device having hole penetrating stack structure
SK HYNIX INC6 citations82
US11495545B2Nov 8, 2022
Semiconductor package including a bridge die
SK HYNIX INC3 citations73
US11322446B2May 3, 2022
System-in-packages including a bridge die
SK HYNIX INC5 citations73
US11075111B2Jul 27, 2021
Vertical semiconductor device and method for fabricating the same
SK HYNIX INC4 citations73
US10991640B2Apr 27, 2021
Semiconductor packages including bridge die
SK HYNIX INC2 citations73
US10658332B2May 19, 2020
Stack packages including bridge dies
SK HYNIX INC5 citations73
US10050019B2Aug 14, 2018
Method of manufacturing wafer level package and wafer level package manufactured thereby
SK HYNIX INC3 citations73
US9613972B1Apr 4, 2017
Method of manufacturing semiconductor device
SK HYNIX INC4 citations73
US9570370B2Feb 14, 2017
Multi chip package and method for manufacturing the same
SK HYNIX INC3 citations73
US8907451B2Dec 9, 2014
Semiconductor chip and semiconductor apparatus with embedded capacitor
SK HYNIX INC4 citations73
HYNIX SEMICONDUCTOR INC
10 patentsUS7446420B1Nov 4, 2008
Through silicon via chip stack package capable of facilitating chip selection during device operation
HYNIX SEMICONDUCTOR INC93 citations98
US7795139B2Sep 14, 2010
Method for manufacturing semiconductor package
HYNIX SEMICONDUCTOR INC47 citations94
US7994621B2Aug 9, 2011
Stacked semiconductor package
HYNIX SEMICONDUCTOR INC20 citations93
US7589410B2Sep 15, 2009
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
HYNIX SEMICONDUCTOR INC40 citations93
US7859115B2Dec 28, 2010
Semiconductor package for improving characteristics for transmitting signals and power
HYNIX SEMICONDUCTOR INC21 citations92
US8026586B2Sep 27, 2011
Semiconductor package
HYNIX SEMICONDUCTOR INC10 citations84
US8018043B2Sep 13, 2011
Semiconductor package having side walls and method for manufacturing the same
HYNIX SEMICONDUCTOR INC13 citations84
US7763498B2Jul 27, 2010
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
HYNIX SEMICONDUCTOR INC9 citations84
US7495340B2Feb 24, 2009
Metal layer structure of semiconductor device
HYNIX SEMICONDUCTOR INC10 citations84
US7446405B2Nov 4, 2008
Wafer level chip scale package (WLCSP) with high reliability against thermal stress
HYNIX SEMICONDUCTOR INC9 citations84
SAMSUNG ELECTRONICS CO LTD
7 patentsUS6167265ADec 26, 2000
Method for managing system fault for CDMA home location register
SAMSUNG ELECTRONICS CO LTD28 citations89
US7505521B2Mar 17, 2009
Data transmission system and method
SAMSUNG ELECTRONICS CO LTD8 citations84
US7965530B2Jun 21, 2011
Memory modules and memory systems having the same
SAMSUNG ELECTRONICS CO LTD14 citations83
US9720499B2Aug 1, 2017
Display apparatus
SAMSUNG ELECTRONICS CO LTD10 citations82
US7646212B2Jan 12, 2010
Memory system including a power divider on a multi module memory bus
SAMSUNG ELECTRONICS CO LTD13 citations82
US5941950AAug 24, 1999
Socket binding method in communication system using socket function
SAMSUNG ELECTRONICS CO LTD17 citations82
US11561919B2Jan 24, 2023
Memory controller, method of operating memory controller and storage device
SAMSUNG ELECTRONICS CO LTD2 citations73
DAEWOO ELECTRONICS CO LTD
4 patentsUS5621468AApr 15, 1997
Motion adaptive spatio-temporal filtering of video signals
DAEWOO ELECTRONICS CO LTD26 citations93
US5491519AFeb 13, 1996
Pre-processing filter apparatus for use in an image encoding system
DAEWOO ELECTRONICS CO LTD48 citations93
US5502510AMar 26, 1996
Method for temporal filtering of video signals using a motion adaptive spatial filter
DAEWOO ELECTRONICS CO LTD30 citations92
US5541660AJul 30, 1996
Systolic realization of motion compensated interpolation filter
DAEWOO ELECTRONICS CO LTD29 citations90
KIM JONG HOON
4 patentsUS8110910B2Feb 7, 2012
Stack package
KIM JONG HOON32 citations92
US7687698B2Mar 30, 2010
Apparatus for adjusting neck angle of guitar
KIM JONG HOON16 citations84
US8154135B2Apr 10, 2012
Stacked semiconductor package
KIM JONG HOON15 citations83
US8203204B2Jun 19, 2012
Stacked semiconductor package
KIM JONG HOON5 citations74
LG ELECTRONICS INC
2 patentsSAMSUNG DISPLAY CO LTD
2 patentsCHEIL JEDANG CORP
1 patentKLA TENCOR CORP
1 patentKIM HYUNG JOON
1 patentKIM KYUNG-WOOK
1 patentCJ CORP
1 patentKIM BYEONG SAM
1 patentLG HOUSEHOLD & HEALTH CARE LTD
1 patentKIM JONG-HOON
1 patentShowing the top 50 of 210 patents by PatentIndex Score.