Inventor
RODRIGUEZ RENNIER
PH18 patents
⚠️ This page may combine multiple inventors who share the name “RODRIGUEZ RENNIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS INC
17 patentsUS9953933B1Apr 24, 2018
Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die
ST MICROELECTRONICS INC7 citations83
US10109563B2Oct 23, 2018
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC6 citations82
US10957634B2Mar 23, 2021
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC1 citations71
US10615104B2Apr 7, 2020
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC2 citations71
US10535588B2Jan 14, 2020
Die with metallized sidewall and method of manufacturing
ST MICROELECTRONICS INC3 citations71
US10763194B2Sep 1, 2020
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
ST MICROELECTRONICS INC2 citations69
US11664239B2May 30, 2023
Lead frame for improving adhesive fillets on semiconductor die corners
ST MICROELECTRONICS INC0 citations61
US11037864B2Jun 15, 2021
Lead frame for improving adhesive fillets on semiconductor die corners
ST MICROELECTRONICS INC0 citations61
US12159820B2Dec 3, 2024
Flat no-lead package with surface mounted structure
ST MICROELECTRONICS INC0 citations60
US12074100B2Aug 27, 2024
Flat no-lead package with surface mounted structure
ST MICROELECTRONICS INC0 citations60
US11552007B2Jan 10, 2023
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC0 citations60
US10892212B2Jan 12, 2021
Flat no-lead package with surface mounted structure
ST MICROELECTRONICS INC0 citations60
US12170240B2Dec 17, 2024
Lead frame for improving adhesive fillets on semiconductor die corners
ST MICROELECTRONICS INC0 citations59
US11688715B2Jun 27, 2023
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
ST MICROELECTRONICS INC0 citations57
US11152326B2Oct 19, 2021
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
ST MICROELECTRONICS INC0 citations57
US10796984B2Oct 6, 2020
Leadframe having a conductive layer protruding through a lead recess
ST MICROELECTRONICS INC1 citations57
US9761538B1Sep 12, 2017
Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer
ST MICROELECTRONICS INC0 citations48