Inventor
AGUDON AIZA MARIE
PH9 patents
Patents
9 patentsUS10109563B2Oct 23, 2018
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC6 citations82
US10957634B2Mar 23, 2021
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC1 citations71
US10615104B2Apr 7, 2020
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC2 citations71
US10535588B2Jan 14, 2020
Die with metallized sidewall and method of manufacturing
ST MICROELECTRONICS INC3 citations71
US12159820B2Dec 3, 2024
Flat no-lead package with surface mounted structure
ST MICROELECTRONICS INC0 citations60
US12074100B2Aug 27, 2024
Flat no-lead package with surface mounted structure
ST MICROELECTRONICS INC0 citations60
US11552007B2Jan 10, 2023
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC0 citations60
US10892212B2Jan 12, 2021
Flat no-lead package with surface mounted structure
ST MICROELECTRONICS INC0 citations60
US9761538B1Sep 12, 2017
Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer
ST MICROELECTRONICS INC0 citations48