Inventor

TALLEDO JEFFERSON

PH46 patents

⚠️ This page may combine multiple inventors who share the name “TALLEDO JEFFERSON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TALLEDO JEFFERSON

ST MICROELECTRONICS INC

Leadframe package with side solder ball contact and method of manufacturing

Semiconductor device with frame having arms and related methods

Semiconductor device with lead frame contact solder balls and related methods

Modified leadframe design with adhesive overflow recesses

Protection from ESD during the manufacturing process of semiconductor chips

Compact leadframe package

Semiconductor package having die pad with cooling fins

Semiconductor package having die pad with cooling fins

Leadframe with pad anchoring members and method of forming the same

Method for making semiconductor device with lead frame made from top and bottom components and related devices

Semiconductor package with integrated heatsink

Modified leadframe design with adhesive overflow recesses

Modified leadframe design with adhesive overflow recesses

Die with metallized sidewall and method of manufacturing

Leadframe with pad anchoring members and method of forming the same

Semiconductor package with flexible interconnect

Compact leadframe package

Semiconductor package with a cavity in a die pad for reducing voids in the solder

Method for making semiconductor device with sidewall recess and related devices

Lead frame for improving adhesive fillets on semiconductor die corners

Lead frame for improving adhesive fillets on semiconductor die corners

Semiconductor device with frame having arms and related methods

Leadframe package with pre-applied filler material

Modified leadframe design with adhesive overflow recesses

Leadframe package with pre-applied filler material

Leadframe package with pre-applied filler material

Leadframe package with side solder ball contact and method of manufacturing

Manufacturing method for semiconductor package with cantilever pads

Protection from ESD during the manufacturing process of semiconductor chips

Semiconductor package having a semiconductor die on a plated conductive layer

Tapeless leadframe package with underside resin and solder contact

Leadframe package with stable extended leads

Tapeless leadframe package with underside resin and solder contact

Method for making semiconductor device with sidewall recess and related devices

Leadframe package with stable extended leads

Stacked semiconductor package with compliant corners on folded substrate

Semiconductor device with encapsulated lead frame contact area and related methods

Semiconductor device including conductive clip with flexible leads and related methods

Leadframe package with side solder ball contact and method of manufacturing

Leadframe package with side solder ball contact and method of manufacturing

Semiconductor package with cantilever pads

Semiconductor package with individually molded leadframe and die coupled at solder balls

Semiconductor packages separated using a sacrificial material

Stacked semiconductor packages with cantilever pads

Semiconductor device with sloped sidewall and related methods

ST MICROELECTRONICS SRL

Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors