P

Inventor

DEKKER RONALD

NL97 patents
⚠️ This page may combine multiple inventors who share the name “DEKKER RONALD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PHILIPS CORP

14 patents
US6177707B1Jan 23, 2001

Semiconductor device comprising a glass supporting body onto which a substrate with semiconductor elements and a metalization is attached by means of an adhesive

PHILIPS CORP64 citations94
US5504036AApr 2, 1996

Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material provided on a support slice

PHILIPS CORP83 citations92
US6368946B1Apr 9, 2002

Manufacture of a semiconductor device with an epitaxial semiconductor zone

PHILIPS CORP20 citations91
US5554256ASep 10, 1996

Method of manufacturing a semiconductor device having a semiconductor body with field insulation regions formed by grooves filled with insulating material

PHILIPS CORP26 citations91
US5689138ANov 18, 1997

Integrated microwave semiconductor device with active and passive components

PHILIPS CORP33 citations90
US5770487AJun 23, 1998

Method of manufacturing a device, by which method a substrate with semiconductor element and conductor tracks is glued to a support body with metallization

PHILIPS CORP17 citations82
US5915187AJun 22, 1999

Method of manufacturing a semiconductor device with a pn junction provided through epitaxy

PHILIPS CORP19 citations80
US5629554AMay 13, 1997

Semiconductor device with a bipolar transistor formed in a layer of semiconductor material provided on an insulating substrate

PHILIPS CORP9 citations73
US6323533B1Nov 27, 2001

Semiconductor device with an operating frequency larger than 50 MHz comprising a body composed of a soft ferrite material

PHILIPS CORP8 citations72
US5780354AJul 14, 1998

Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer

PHILIPS CORP11 citations71
US5753537AMay 19, 1998

Method of manufacturing a semiconductor device for surface mounting

PHILIPS CORP13 citations71
US5405789AApr 11, 1995

Method of manufacturing a semiconductor device whereby a laterally bounded semiconductor zone is formed in a semiconductor body in a self-aligning manner

PHILIPS CORP8 citations69
US6060968AMay 9, 2000

Device with circuit element and transmission line formed by a dielectric between facing conductor strips

PHILIPS CORP8 citations68
US5739591AApr 14, 1998

Semiconductor device with a carrier body on which a substrate with a semiconductor element is fastened by means of a glue layer and on which a pattern of conductor tracks is fastened

PHILIPS CORP5 citations63

KONINKL PHILIPS ELECTRONICS NV

10 patents

DEKKER RONALD

6 patents

KONINKLIJKE PHILIPS NV

5 patents

OCTROLIX BV

4 patents

HAARTSEN JAAP ROGER

2 patents

HEIDEMAN RENE GERRIT

2 patents

LIONIX INT BV

2 patents

KLEE MAREIKE

1 patent

NXP BV

1 patent

KONINKL PHILIPS NV

1 patent

KOEHLER MAX OSKAR

1 patent

BALDUS HERIBERT

1 patent

Showing the top 50 of 97 patents by PatentIndex Score.