Inventor
HUANG JESSE
TW7 patents
⚠️ This page may combine multiple inventors who share the name “HUANG JESSE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES BERMUDA
3 patentsUS6703075B1Mar 9, 2004
Wafer treating method for making adhesive dies
CHIPMOS TECHNOLOGIES BERMUDA37 citations91
US6689638B2Feb 10, 2004
Substrate-on-chip packaging process
CHIPMOS TECHNOLOGIES BERMUDA19 citations81
USRE42349EMay 10, 2011
Wafer treating method for making adhesive dies
CHIPMOS TECHNOLOGIES BERMUDA2 citations62
SEMICONDUCTOR MFG INT SHANGHAI
2 patentsUS8351748B2Jan 8, 2013
Mask-less method and structure for patterning photosensitive material using optical fibers
SEMICONDUCTOR MFG INT SHANGHAI0 citations46
US8053178B2Nov 8, 2011
Mask-less method and structure for patterning photosensitive material using optical fibers
SEMICONDUCTOR MFG INT SHANGHAI1 citations46