Inventor
BECKER WIREN DALE
US12 patents
⚠️ This page may combine multiple inventors who share the name “BECKER WIREN DALE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS7362697B2Apr 22, 2008
Self-healing chip-to-chip interface
IBM92 citations97
US7233170B2Jun 19, 2007
Programmable driver delay
IBM22 citations92
US7813266B2Oct 12, 2010
Self-healing chip-to-chip interface
IBM11 citations84
US7382844B2Jun 3, 2008
Methods to self-synchronize clocks on multiple chips in a system
IBM19 citations82
US7284992B2Oct 23, 2007
Electronic package structures using land grid array interposers for module-to-board interconnection
IBM13 citations82
US11133259B2Sep 28, 2021
Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network
IBM4 citations73
US6774836B2Aug 10, 2004
Method for delta-noise reduction
IBM3 citations61
US7987587B2Aug 2, 2011
Method of forming solid vias in a printed circuit board
IBM5 citations60
US12266598B2Apr 1, 2025
Dense via pitch interconnect to increase wiring density
IBM0 citations50
BECKER WIREN DALE
3 patentsUS8261226B1Sep 4, 2012
Network flow based module bottom surface metal pin assignment
BECKER WIREN DALE13 citations82
US8339803B2Dec 25, 2012
High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
BECKER WIREN DALE2 citations60
US8683413B2Mar 25, 2014
Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
BECKER WIREN DALE0 citations50